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LM2663MX Datasheet(PDF) 4 Page - Texas Instruments

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No. de pieza LM2663MX
Descripción Electrónicos  LM266x Switched Capacitor Voltage Converter
Download  25 Pages
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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LM2662, LM2663
SNVS002E – JANUARY 1999 – REVISED OCTOBER 2014
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2)
MIN
MAX
UNIT
Supply voltage (V+ to GND, or GND to OUT)
6
LV
(OUT
− 0.3 V)
(GND + 3 V)
V
FC, OSC, SD
The least negative of (OUT
− 0.3 V)
or (V+
− 6 V) to (V+ + 0.3 V)
V+ and OUT continuous output current
250
Output short-circuit duration to GND(3)
1
sec.
Power dissipation (TA = 25°C)
(4)
735
mW
TJ max
(4)
150
Operating ambient temperature
−40
85
°C
Operating junction temperature
−40
105
Lead temperature (soldering, 10 seconds)
300
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3)
OUT may be shorted to GND for one second without damage. However, shorting OUT to V+ may damage the device and should be
avoided. Also, for temperatures above 85°C, OUT must not be shorted to GND or V+, or device may be damaged.
(4)
The maximum allowable power dissipation is calculated by using PDMax = (TJMax − TA)/RθJA, where TJMax is the maximum junction
temperature, TA is the ambient temperature, and RθJA is the junction-to-ambient thermal resistance of the specified package.
6.2 Handling Ratings
MIN
MAX
UNIT
Tstg
Storage temperature range
−65
150
°C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
2000
V(ESD)
Electrostatic discharge
V
pins(1)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
V+ (supply voltage)
2.5
5.5
V
Junction temperature (TJ)
–40
105
°C
Ambient temperature (TJ)
–40
85
6.4 Thermal Information
LM2662
LM2663
THERMAL METRIC(1)
SOIC (D)
UNIT
8 PINS
RθJA
Junction-to-ambient thermal resistance
170
170
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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Copyright © 1999–2014, Texas Instruments Incorporated
Product Folder Links: LM2662 LM2663


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