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LM21212-2 Datasheet(PDF) 2 Page - Texas Instruments

No. de pieza LM21212-2
Descripción Electrónicos  12A High Efficiency Synchronous Buck Regulator with Adjustable Switching Frequency
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI - Texas Instruments

LM21212-2 Datasheet(HTML) 2 Page - Texas Instruments

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FADJ
SS/TRK
EN
AVIN
PVIN
PVIN
PVIN
PGND
SW
SW
SW
SW
AGND
FB
COMP
PGOOD
EP
Top View
PGND
PGND
12
11 SW
9
10
SW
LM21212-2
SNVS715A – MARCH 2011 – REVISED MARCH 2013
www.ti.com
CONNECTION DIAGRAM
Figure 1. Top View
HTSSOP-20 Package
PIN DESCRIPTIONS
Pins
Name
Description
1
FADJ
Frequency Adjust pin. The switching frequency can be set to a predetermined rate by connecting a resistor
between FADJ and AGND.
2
SS/TRK
Soft-start control pin. An internal 2 µA current source charges an external capacitor connected between
this pin and AGND to set the output voltage ramp rate during startup. This pin can also be used to
configure the tracking feature.
3
EN
Active high enable input for the device. If not used, the EN pin can be left open, which will go high due to
an internal current source.
4
AVIN
Analog input voltage supply that generates the internal bias. It is recommended to connect PVIN to AVIN
through a low pass RC filter to minimize the influence of input rail ripple and noise on the analog control
circuitry.
5,6,7
PVIN
Input voltage to the power switches inside the device. These pins should be connected together at the
device. A low ESR input capacitance should be located as close as possible to these pins.
8,9,10
PGND
Power ground pins for the internal power switches.
11-16
SW
Switch node pins. These pins should be tied together locally and connected to the filter inductor.
17
PGOOD
Open-drain power good indicator.
18
COMP
Compensation pin is connected to the output of the voltage loop error amplifier.
19
FB
Feedback pin is connected to the inverting input of the voltage loop error amplifier.
20
AGND
Quiet analog ground for the internal reference and bias circuitry.
EP
Exposed Pad
Exposed metal pad on the underside of the package with an electrical and thermal connection to PGND. It
is recommended to connect this pad to the PC board ground plane in order to improve thermal dissipation.
2
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Copyright © 2011–2013, Texas Instruments Incorporated
Product Folder Links: LM21212-2


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