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TMP302D Datasheet(PDF) 4 Page - Texas Instruments |
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TMP302D Datasheet(HTML) 4 Page - Texas Instruments |
4 / 18 page TMP302-Q1 SLOS889B – OCTOBER 2014 – REVISED JULY 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Supply voltage 3.6 V Input pin voltage TRIPSET0, TRIPSET1, HYSTSET –0.5 VS + 0.5 V Output pin voltage OUT –0.5 3.6 V Output pin current OUT 10 mA Operating temperature –55 130 °C Junction temperature 150 °C Storage temperature –60 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings VALUE UNIT Human body model (HBM), per AEC Q100-002(1) ±2000 V(ESD) Electrostatic discharge V Charged device model (CDM), per AEC Q100-011 ±1000 (1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VS Power supply voltage 1.4 3.3 3.6 V Rpullup Pullup resistor connected from OUT to VS 10 100 k Ω 7.4 Thermal Information TMP302-Q1 THERMAL METRIC(1) DRL(SOT563) UNIT 6 PINS RθJA Junction-to-ambient thermal resistance 200 °C/W RθJC(top) Junction-to-case (top) thermal resistance 73.7 °C/W RθJB Junction-to-board thermal resistance 34.4 °C/W ψJT Junction-to-top characterization parameter 3.1 °C/W ψJB Junction-to-board characterization parameter 34.2 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: TMP302-Q1 |
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