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FAN53525 Datasheet(PDF) 3 Page - Fairchild Semiconductor

No. de pieza FAN53525
Descripción Electrónicos  3.0A, 2.4MHz, Digitally Programmable TinyBuck Regulator
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Fabricante Electrónico  FAIRCHILD [Fairchild Semiconductor]
Página de inicio  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

FAN53525 Datasheet(HTML) 3 Page - Fairchild Semiconductor

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© 2012 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN53525 • Rev. 1.0.1
21
Physical Dimensions
Figure 39.
15-Ball, Wafer-Level Chip-Scale Package (WLCSP), 3x5 Array, 0.4 mm Pitch, 250 µm Ball
Product-Specific Dimensions
D
E
X
Y
2.015 ±0.03 mm
1.310 ±0.03 mm
0.255 mm
0.2075 mm
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/dwg/UC/UC015AB.pdf.
B
A
BALL A1
INDEX
AREA
C
0.005
CA B
SIDE VIEWS
TOP VIEW
NOTES
A. NO JEDEC REGISTRATION APPLIES.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCE PER
ASME Y14.5 - 2009.
D. DATUM C IS DEFINED BY THE
SPHERICAL CROWNS OF THE BALLS.
E. PACKAGE NOMINAL HEIGHT IS
586 ± 39 MICRONS (547-625 MICRONS).
F. FOR DIMENSIONS D,E,X, AND Y SEE
PRODUCT DATASHEET.
G. DRAWING FILNAME: MKT-UC015AB Rev1
0.03 C
0.03 C
15X
BOTTOM VIEW
0.05 C
0.06 C
RECOMMENDED LAND PATTERN
(NSMD TYPE)
D
2X
2X
E
D
(Ø0.200)
Cu Pad
(Ø0.300)
Solder Mask
Opening
A1
Seating Plane
Ø0.260±0.02
(Y)±0.018
(X)±0.018
0.625
0.547
0.378±0.018
0.208±0.021
0.40
0.40
0.40
0.40
F
F
12 3
A
B
C
D
E
0.80
1.60
0.80
1.60


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