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TPA6166A2 Datasheet(PDF) 4 Page - Texas Instruments |
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TPA6166A2 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 49 page TPA6166A2 SLAS997B – MARCH 2014 – REVISED JANUARY 2015 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating temperature range, TA = 25°C (unless otherwise noted) (1) MIN MAX UNIT Supply voltage, VDD –0.3 2 V Microphone supply voltage, MICVDD –0.3 3.9 V Output continuous total power dissipation See Thermal Information Storage temperature, Tstg –65 85 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE UNIT Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±500 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions MIN MAX UNIT VDD Supply voltage 1.7 1.9 V MICVDD Microphone supply voltage 2.4 3.6 V TA Operating temperature –25 85 °C Line Driver Application, RL = 10 kΩ, AV ≥ 0 dB, specified by design 470 pF Maximum load Line Driver Application, RL = 10 kΩ, AV ≤ 0 dB, LO_EXT_STAB = 1, 470 CL,Max capacitance specified by design Headphone Application, RL = 32 Ω, specified by design 200 TJ Operating junction temperature –25 150 °C 6.4 Thermal Information TPA6166A2 THERMAL METRIC(1) YFF (WSCP) UNIT 25 PINS RθJA Junction-to-ambient thermal resistance 67 RθJC(top) Junction-to-case (top) thermal resistance 18 RθJB Junction-to-board thermal resistance 38 °C/W ψJT Junction-to-top characterization parameter 0.1 ψJB Junction-to-board characterization parameter 36 (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2014–2015, Texas Instruments Incorporated Product Folder Links: TPA6166A2 |
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