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TPA6166A2 Datasheet(PDF) 4 Page - Texas Instruments

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No. de pieza TPA6166A2
Descripción Electrónicos  3.5-mm Jack Detect and Headset Interface IC
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
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TPA6166A2
SLAS997B – MARCH 2014 – REVISED JANUARY 2015
www.ti.com
6 Specifications
6.1 Absolute Maximum Ratings
over operating temperature range, TA = 25°C (unless otherwise noted)
(1)
MIN
MAX
UNIT
Supply voltage, VDD
–0.3
2
V
Microphone supply voltage, MICVDD
–0.3
3.9
V
Output continuous total power dissipation
See Thermal Information
Storage temperature, Tstg
–65
85
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V(ESD)
Electrostatic discharge
V
Charged-device model (CDM), per JEDEC specification JESD22-
±500
C101(2)
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
MIN
MAX
UNIT
VDD
Supply voltage
1.7
1.9
V
MICVDD
Microphone supply voltage
2.4
3.6
V
TA
Operating temperature
–25
85
°C
Line Driver Application, RL = 10 kΩ, AV ≥ 0 dB, specified by design
470
pF
Maximum load
Line Driver Application, RL = 10 kΩ, AV ≤ 0 dB, LO_EXT_STAB = 1,
470
CL,Max
capacitance
specified by design
Headphone Application, RL = 32 Ω, specified by design
200
TJ
Operating junction temperature
–25
150
°C
6.4 Thermal Information
TPA6166A2
THERMAL METRIC(1)
YFF (WSCP)
UNIT
25 PINS
RθJA
Junction-to-ambient thermal resistance
67
RθJC(top)
Junction-to-case (top) thermal resistance
18
RθJB
Junction-to-board thermal resistance
38
°C/W
ψJT
Junction-to-top characterization parameter
0.1
ψJB
Junction-to-board characterization parameter
36
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
4
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