Si53325

6

Rev. 1.0

Table 8. Thermal Conditions

Parameter

Symbol

Test Condition

Value

Unit

32-eLQFP Thermal

Resistance, Junction to

Ambient



JA

Still air

54.9

°C/W

32-eLQFP Thermal

Resistance, Junction to

Case



JC

Still air

10.0

°C/W

32-QFN Thermal

Resistance, Junction to

Ambient



JA

Still air

99.6

°C/W

32-QFN Thermal

Resistance, Junction to

Case



JC

Still air

10.3

°C/W

Table 9. Absolute Maximum Ratings

Parameter

Symbol

Test Condition

Min

Typ

Max

Unit

Storage Temperature

–55

—

150

Supply Voltage

–0.5

—

3.8

V

Input Voltage

–0.5

—

0.3

V

Output Voltage

——

0.3

V

ESD Sensitivity

HBM

HBM, 100 pF, 1.5 kΩ

—

—

2000

V

ESD Sensitivity

CDM

—

—

500

V

Peak Soldering Reflow

Temperature

Pb-Free; Solder reflow profile per

JEDEC J-STD-020

—

—

260

Maximum Junction

Temperature

—

—

125

Note:

Stresses beyond those listed in this table may cause permanent damage to the device. Functional operation

specification compliance is not implied at these conditions. Exposure to maximum rating conditions for extended

periods may affect device reliability.