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TPD3S714-Q1

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SLVSCG4 – JANUARY 2016

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Copyright © 2016, Texas Instruments Incorporated

(1)

Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may

degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond

those specified is not implied.

(2)

The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

Supply voltage from USB connector

–0.3

18

V

Internal Supply DC voltage Rail on the PCB

–0.3

6

V

Voltage range from connector-side USB data lines

VD+, VD–

–0.3

18

V

Voltage range for internal USB data lines

D+, D–

–0.3

V

-0.3

4

V

Voltage on enable pin

EN

7

V

Operating free air temperature

–40

125

°C

Storage temperature

–65

150

°C

(1)

The passing level per AEC-Q100 Classification H3.

(2)

The passing level per AEC-Q100 Classification C6.

(3)

Refer to ESD Test Setup diagram for details on system level ESD testing setup.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

Human body model (HBM), ESD stress voltage, all

All pins

±4000

V

Charged device model (CDM), ESD stress voltage, all

All pins

±1500

±8000

±15000

ISO 10605 (330pF, 330

±8000

ISO 10605 (330pF, 330

±15000

(1)

See typical application diagram for configuration details

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Supply voltage from USB connector

5.25

V

Internal Supply DC voltage Rail on the PCB

4.75

5.25

V

VD+, VD–

Voltage range from connector-side USB data lines

0

V

D+, D–

Voltage range for internal USB data lines

0

V

3

3.6

V

500

mA

EN

Voltage range for enable

0

5.9

V

100

µF

1

µF

(1)

1

µF