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STAP08DP5XTTR Datasheet(PDF) 6 Page - STMicroelectronics |
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STAP08DP5XTTR Datasheet(HTML) 6 Page - STMicroelectronics |
6 / 28 page Maximum rating STAP08DP05 6/28 DocID024305 Rev 6 3 Maximum rating Stressing the device above the rating listed in the “absolute maximum ratings” table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 3.1 Absolute maximum ratings 3.2 Thermal data Table 4. Absolute maximum ratings Symbol Parameter Value Unit VDD Supply voltage IGND 0 to 7 V VO Output voltage -0.5 to 20 V IO Output current 100 mA IGND GND terminal current 800 mA fCLK Clock frequency 50 MHz TOPR Operating temperature range -40 to +150 °C TSTG Storage temperature range -55 to +150 °C Table 5. Thermal data Symbol Parameter Value (1) 1. The exposed pad should be soldered to the PCB in order to derive the thermal benefits (according to Jedec 51-7). Unit RthJA Thermal resistance junction-ambient 37.5 °C/W |
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