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LSF0204DPWR Datasheet(PDF) 5 Page - Texas Instruments |
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LSF0204DPWR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 32 page LSF0204, LSF0204D www.ti.com SLVSCP5D – JULY 2014 – REVISED DECEMBER 2015 8 Specifications 8.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VI Input voltage (2) –0.5 7 V VI/O Input/output voltage (2) –0.5 7 V Continuous channel current 128 mA IIK Input clamp current VI < 0 –50 mA TJ Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) The input and input/output negative-voltage ratings may be exceeded if the input and input/output clamp-current ratings are observed. 8.2 ESD Ratings VALUE UNIT Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V(ESD) Electrostatic discharge V Charged-device model (CDM), per JEDEC specification JESD22- ±1000 C101(2) (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 500-V HBM is possible with the necessary precautions. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. Manufacturing with less than 250-V CDM is possible with the necessary precautions. 8.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VI/O Input/output voltage 0 5 V Vref_A/B/EN Reference voltage 0 5 V IPASS Pass transistor current 64 mA TA Operating free-air temperature –40 125 °C 8.4 Thermal Information LSF0204 THERMAL METRIC(1) RGY (VQFN) RUT (UQFN) PW (TSSOP) UNIT 14 PINS 12 PINS 14 PINS RθJA Junction-to-ambient thermal resistance 83.2 195.8 157.9 °C RθJC(top) Junction-to-case (top) thermal resistance 98.2 98.7 82.3 °C RθJB Junction-to-board thermal resistance 59.2 122.6 100.0 °C ψJT Junction-to-top characterization parameter 17.4 6.2 22.9 °C ψJB Junction-to-board characterization parameter 59.4 122.6 99.0 °C RθJC(bot) Junction-to-case (bottom) thermal resistance 38.7 N/A N/A °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2014–2015, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Links: LSF0204 LSF0204D |
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