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SN74LV125APW Datasheet(PDF) 5 Page - Texas Instruments |
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SN74LV125APW Datasheet(HTML) 5 Page - Texas Instruments |
5 / 29 page 5 SN74LV125A www.ti.com SCES124N – DECEMBER 1997 – REVISED JANUARY 2016 Product Folder Links: SN74LV125A Submit Documentation Feedback Copyright © 1997–2016, Texas Instruments Incorporated (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) SN74LV125A UNIT MIN MAX VCC Supply voltage 2 5.5 V VIH High-level input voltage VCC = 2 V 1.5 V VCC = 2.3 V to 2.7 V VCC × 0.7 VCC = 3 V to 3.6 V VCC × 0.7 VCC = 4.5 V to 5.5 V VCC × 0.7 VIL Low-level input voltage VCC = 2 V 0.5 V VCC = 2.3 V to 2.7 V VCC × 0.3 VCC = 3 V to 3.6 V VCC × 0.3 VCC = 4.5 V to 5.5 V VCC × 0.3 VI Input voltage 0 5.5 V VO Output voltage High or low state 0 VCC V 3-state 0 5.5 IOH High-level output current VCC = 2 V –50 µA VCC = 2.3 V to 2.7 V –2 mA VCC = 3 V to 3.6 V –8 VCC = 4.5 V to 5.5 V –16 IOL Low-level output current VCC = 2 V 50 µA VCC = 2.3 V to 2.7 V 2 mA VCC = 3 V to 3.6 V 8 VCC = 4.5 V to 5.5 V 16 ∆t/∆v Input transition rise or fall rate VCC = 2.3 V to 2.7 V 200 ns/V VCC = 3 V to 3.6 V 100 VCC = 4.5 V to 5.5 V 20 TA Operating free-air temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report (SPRA953). 7.4 Thermal Information THERMAL METRIC(1) SN74LV125A UNIT D DB DGV N NS PW RGY 14 PINS RθJA Junction-to-ambient thermal resistance 92.7 105.0 127.6 89.2 89.6 119.8 55.0 °C/W RθJC(top) Junction-to-case (top) thermal resistance 54.1 57.5 50.7 47.0 47.2 48.6 67.4 RθJB Junction-to-board thermal resistance 47.0 52.3 60.5 47.9 48.4 61.5 31.0 ψJT Junction-to-top characterization parameter 18.9 19.1 6.1 14.1 14.0 5.7 2.6 ψJB Junction-to-board characterization parameter 46.7 51.8 59.8 47.5 48.1 61.0 31.1 RθJC(bot) Junction-to-case (bottom) thermal resistance — — — — — — 11.6 |
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