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FSBB30CH60D Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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FSBB30CH60D Datasheet(HTML) 1 Page - Fairchild Semiconductor |
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1 / 15 page  ©2014 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FSBB30CH60D Rev. C0 August 2014 FSBB30CH60D Motion SPM® 3 Series Features • UL Certified No. E209204 (UL1557) • 600 V - 30 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection • Low-Loss, Short-Circuit Rated IGBTs • Very Low Thermal Resistance Using Al2O3 DBC Substrate • Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout • Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing • Single-Grounded Power Supply • LVIC Temperature-Sensing Built-In for Temperature Monitoring • Isolation Rating: 2500 Vrms / 1 min. Applications • Motion Control - Home Appliance / Industrial Motor Related Resources • AN-9085 - Motion SPM® 3 Ver.5 Series Users Guide • AN-9086 - SPM 3 Package Mounting Guide • AN-9087 - Motion SPM® 3 Ver.5 Series Thermal Performance Information General Description FSBB30CH60D is an advanced Motion SPM® 3 module providing a fully-featured, high-performance inverter output stage for AC Induction, BLDC, and PMSM motors. These modules integrate optimized gate drive of the built-in IGBTs to minimize EMI and losses, while also providing multiple on-module protection features includ- ing under-voltage lockouts, over-current shutdown, thermal monitoring of drive IC, and fault reporting. The built-in, high-speed HVIC requires only a single supply voltage and translates the incoming logic-level gate inputs to the high-voltage, high-current drive signals required to properly drive the module's internal IGBTs. Separate negative IGBT terminals are available for each phase to support the widest variety of control algorithms. Package Marking and Ordering Information Figure 1. Package Overview Device Device Marking Package Packing Type Quantity FSBB30CH60D FSBB30CH60D SPMPA-027 Rail 10 |
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