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TPA6139A2PWR Datasheet(PDF) 4 Page - Texas Instruments |
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TPA6139A2PWR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page 4 TPA6139A2 SLOS700C – JANUARY 2011 – REVISED APRIL 2016 www.ti.com Product Folder Links: TPA6139A2 Submit Documentation Feedback Copyright © 2011–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD to GND –0.3 4 V Input voltage, VI VSS – 0.3 VDD + 0.3 V MUTE to GND –0.3 VDD + 0.3 V Maximum operating junction temperature, TJ –40 150 °C Lead temperature 260 °C Storage temperature, Tstg –40 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT TPA6139A2 IN PW PACKAGE V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins except 2 and 13 ±4000 V Pins 2 and 13 ±8000 Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 TPA6139A2 IN RGT PACKAGE V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) All pins except 1 and 12 ±4000 V Pins 1 and 12 ±8000 Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500 7.3 Recommended Operating Conditions over operating free-air temperature range unless otherwise noted MIN NOM MAX UNIT VDD Supply voltage DC supply voltage 3 3.3 3.6 V RL Load resistance 16 32 10000 Ω VIL Low-level input voltage MUTE 38 40 43 %PVDD VIH High-level input voltage MUTE 57 60 66 %PVDD TA Free-air temperature –40 25 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 7.4 Thermal Information THERMAL METRIC(1) TPA6139A2 UNIT PW (TSSOP) RGT (VQFN) 14 PINS 16 PINS RθJA Junction-to-ambient thermal resistance 130 52 °C/W RθJC(top) Junction-to-case (top) thermal resistance 49 71 °C/W RθJB Junction-to-board thermal resistance 63 26 °C/W ψJT Junction-to-top characterization parameter 3.6 3 °C/W ψJB Junction-to-board characterization parameter 62 26 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance — 9.8 °C/W |
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