LM10504

SNVS739E – DECEMBER 2011 – REVISED MARCH 2013

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Table 2. PIN DESCRIPTIONS (continued)

Pin #

Pin Name

Functional Description

Digital Input Startup Control Signal to change predefined output Voltage of Buck 3,

F4

Vselect_B3

I

D

internally pulled up as a default.

Digital Input Control Signal for entering Device Sleep Mode. This is an active High pin

E7

DevSLP

I

D

with an internal pulldown resistor. Lowers core ASIC voltage and turns off the FLASH

and I/O bucks.

Digital Input Control Signal to abort SPI transactions; resets the PMIC to default

F7

RESET

I

D

voltages. This is an active Low pin with an internal pullup.

C7

VCOMP

I

A

Analog Input for Comparator

A1

Interrupt

O

D

Digital Output of Comparator to signal interrupt condition

F1

SPI_CS

I

D

SPI Interface - chip select

D1

SPI_DI

I

D

SPI Interface - serial data input

E1

SPI_DO

O

D

SPI Interface - serial data output

C1

SPI_CLK

I

D

SPI Interface - serial clock input

B1

VIN_IO

I

A

Supply Voltage for Digital Interface

B2

GND

G

G

Ground. Connect to system Ground.

B3

GND

G

G

Ground. Connect to system Ground.

D7

GND

G

G

Connect to system Ground; decouple closely to A3.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

Absolute Maximum Ratings

(1) (2)

VIN, VCOMP

−0.3V to +6.0V

VIN_IO, VIN_B1, VIN_B2, VIN_B3, SPI_CS, SPI_DI, SPI_CLK, SPI_DO, Vselect_B2,Vselect_B3,

RESET, SW_1, SW_2, SW_3, FB_1, FB_2, FB_3, LDO, Interrupt, DevSLP

−0.3V to +6.0V

150°C

Storage Temperature

−65°C to 150°C

ESD Rating

Human Body Model (HBM)

2.0kV

(1)

Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which

operation of the device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and

associated test conditions, see the Electrical Characteristics tables.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

Operating Ratings

(1) (2) (3)

VIN_B1, VIN_B2_VIN_B3, VIN

3.0V to 5.5V

VIN_IO

All pins other than VIN_IO

−30°C to 125°C

−30°C to 85°C

Junction-to-Ambient Thermal Resistance (

44.5°C/W

0.9W

(1)

Internal thermal shutdown protects device from permanent damage. Thermal shutdown engages at TJ = +140°C and disengages at TJ

= +120°C (typ.). Thermal shutdown is ensured by design.

(2)

In applications where high power dissipation and/or poor thermal resistance is present the maximum ambient temperature may have to

part/package in the application (

(3)

The amount of Absolute Maximum power dissipation allowed for the device depends on the ambient temperature and can be calculated

ambient thermal resistance.

from permanent damage. (See General Electrical Characteristics.)

4

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