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LM3530 Datasheet(PDF) 4 Page - Texas Instruments

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No. de pieza LM3530
Descripción Electrónicos  High-Efficiency White-LED Driver
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

LM3530 Datasheet(HTML) 4 Page - Texas Instruments

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LM3530
SNVS606L – JUNE 2009 – REVISED DECEMBER 2014
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1) (2) (3)
MIN
MAX
UNIT
VIN to GND
–0.3
6
VSW, VOVP, VILED to GND
45
VSCL, VSDA, VALS1, VPWM, VINT, VHWEN to GND
6
V
VALS2 to GND
–0.3 V to VIN + 0.3 V
Continuous power dissipation
Internally limited
Junction temperature (TJ-MAX)
150
°C
Maximum lead temperature (soldering, 10s)
See(4)
Storage temperature, Tstg
–65
150
°C
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2)
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3)
All voltages are with respect to the potential at the GND pin.
(4)
For detailed soldering specifications and information, please refer to Application Note 1112: DSBGA Wafer Level Chip Scale Package
(SNVA009).
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
V
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN to GND
2.7
5.5
V
VSW, VOVP, VILED, to GND
0
40
Junction temperature (TJ)
(1)
–40
125
°C
Ambient temperature (TA)
(2)
–40
85
(1)
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 140°C (typ.) and
disengages at TJ= 125°C (typ.).
(2)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).
7.4 Thermal Information
DSBGA
THERMAL METRIC(1)
YFQ
YFZ
UNIT
12 PINS
RθJA
Junction-to-ambient thermal resistance(2)
61.7
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2)
Junction-to-ambient thermal resistance (RθJA) is taken from a thermal modeling result, performed under the conditions and guidelines
set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2 x 1
array of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/3 6µm
(1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C in still air. Power dissipation is 1W. The value of RθJA of this product in
the DSBGA package could fall in a range as wide as 60ºC/W to 110ºC/W (if not wider), depending on PCB material, layout, and
environmental conditions. In applications where high maximum power dissipation exists special care must be paid to thermal dissipation
issues.
4
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