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LM3530 Datasheet(PDF) 4 Page - Texas Instruments |
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LM3530 Datasheet(HTML) 4 Page - Texas Instruments |
4 / 50 page LM3530 SNVS606L – JUNE 2009 – REVISED DECEMBER 2014 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) (3) MIN MAX UNIT VIN to GND –0.3 6 VSW, VOVP, VILED to GND 45 VSCL, VSDA, VALS1, VPWM, VINT, VHWEN to GND 6 V VALS2 to GND –0.3 V to VIN + 0.3 V Continuous power dissipation Internally limited Junction temperature (TJ-MAX) 150 °C Maximum lead temperature (soldering, 10s) See(4) Storage temperature, Tstg –65 150 °C (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. (3) All voltages are with respect to the potential at the GND pin. (4) For detailed soldering specifications and information, please refer to Application Note 1112: DSBGA Wafer Level Chip Scale Package (SNVA009). 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VIN to GND 2.7 5.5 V VSW, VOVP, VILED, to GND 0 40 Junction temperature (TJ) (1) –40 125 °C Ambient temperature (TA) (2) –40 85 (1) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 140°C (typ.) and disengages at TJ= 125°C (typ.). (2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). 7.4 Thermal Information DSBGA THERMAL METRIC(1) YFQ YFZ UNIT 12 PINS RθJA Junction-to-ambient thermal resistance(2) 61.7 °C/W (1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. (2) Junction-to-ambient thermal resistance (RθJA) is taken from a thermal modeling result, performed under the conditions and guidelines set forth in the JEDEC standard JESD51-7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2 x 1 array of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/18 µm/18 µm/3 6µm (1.5oz/1oz/1oz/1.5oz). Ambient temperature in simulation is 22°C in still air. Power dissipation is 1W. The value of RθJA of this product in the DSBGA package could fall in a range as wide as 60ºC/W to 110ºC/W (if not wider), depending on PCB material, layout, and environmental conditions. In applications where high maximum power dissipation exists special care must be paid to thermal dissipation issues. 4 Submit Documentation Feedback Copyright © 2009–2014, Texas Instruments Incorporated Product Folder Links: LM3530 |
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