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SN74CB3Q3345DGVR Datasheet(PDF) 1 Page - Texas Instruments |
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SN74CB3Q3345DGVR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 19 page www.ti.com FEATURES 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 OE A1 A2 A3 A4 A5 A6 A7 A8 GND VCC OE B1 B2 B3 B4 B5 B6 B7 B8 DBQ, DGV, OR PW PACKAGE (TOP VIEW) RGY PACKAGE (TOP VIEW) 1 20 10 11 2 3 4 5 6 7 8 9 19 18 17 16 15 14 13 12 OE B1 B2 B9 B4 B5 B6 B7 A1 A2 A3 A4 A5 A6 A7 A8 SN74CB3Q3345 8-BIT FET BUS SWITCH 2.5-V/3.3-V LOW-VOLTAGE HIGH-BANDWIDTH BUS SWITCH SCDS144B – OCTOBER 2003 – REVISED MARCH 2005 • Data and Control Inputs Provide Undershoot Clamp Diodes • High-Bandwidth Data Path (up to 500 MHz (1)) • Low Power Consumption (I CC = 0.7 mA Typ) • 5-V-Tolerant I/Os With Device Powered Up or Powered Down • V CC Operating Range From 2.3 V to 3.6 V • Low and Flat ON-State Resistance (r on) • Data I/Os Support 0- to 5-V Signaling Levels Characteristics Over Operating Range (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) (r on = 4 Ω Typ) • Control Inputs Can Be Driven by TTL or • Rail-to-Rail Switching on Data I/O Ports 5-V/3.3-V CMOS Outputs – 0- to 5-V Switching With 3.3-V V CC • I off Supports Partial-Power-Down Mode Operation – 0- to 3.3-V Switching With 2.5-V V CC • Latch-Up Performance Exceeds 100 mA Per • Bidirectional Data Flow With Near-Zero JESD 78, Class II Propagation Delay • ESD Performance Tested Per JESD 22 • Low Input/Output Capacitance Minimizes Loading and Signal Distortion – 2000-V Human-Body Model (C io(OFF) = 4 pF Typ) (A114-B, Class II) • Fast Switching Frequency (f OE = 20 MHz Max) – 1000-V Charged-Device Model (C101) • Supports Both Digital and Analog (1) For additional information regarding the performance Applications: Differential Signal Interface, characteristics of the CB3Q family, refer to the TI application Memory Interleaving, Bus Isolation, report, CBT-C, CB3T, and CB3Q Signal-Switch Families, literature number SCDA008. Low-Distortion Signal Gating Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2005, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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