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TDA3X Datasheet(PDF) 2 Page - Texas Instruments |
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TDA3X Datasheet(HTML) 2 Page - Texas Instruments |
2 / 6 page TDA3 SPRT704A – OCTOBER 2014 – REVISED OCTOBER 2014 www.ti.com 1.3 Description TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet the requirements of leading Advanced Driver Assistance Systems (ADAS). TDA3x SoC processors enable broad ADAS applications by integrating an optimal mix of performance, low power, smaller form factor and ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving experience. The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar, and fusion on a single architecture. The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and floating-point TMS320C66x digital signal processors (DSP), Vision AccelerationPac with Embedded Vision Engines (EVE), and dual ARM Cortex-M4 processors. The device allows low power profile in different package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems, displays, CAN and GigB Ethernet AVB. The EVE within the TDA3x Vision AccelerationPac offloads the vision analytics functionality from the processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing. Additionally, Texas Instruments provides a complete set of development tools for the ARM, DSP, and EVE coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a debugging interface for visibility into source code execution. The TDA3x SoC processor is qualified according to AEC-Q100 standard. Device Information PART NUMBER PACKAGE BODY SIZE TDA3x (ABF package) S-PBGA (367) 15.0 mm x 15.0 mm TDA3x (ABE package) S-PBGA (244) 12.0 mm x 12.0 mm 2 Device Overview Copyright © 2014, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: TDA3 |
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