TDA3

SPRT704A – OCTOBER 2014 – REVISED OCTOBER 2014

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1.3

Description

TI’s TDA3x System-on-Chip (SoC) is a highly optimized and scalable family of devices designed to meet

the requirements of leading Advanced Driver Assistance Systems (ADAS). TDA3x SoC processors enable

broad ADAS applications by integrating an optimal mix of performance, low power, smaller form factor and

ADAS vision analytics processing that aims to facilitate a more autonomous and collision-free driving

experience.

The TDA3x SoC enables sophisticated embedded vision technology in today’s automobile by enabling the

industry’s broadest range of ADAS applications including front camera, rear camera, surround view, radar,

and fusion on a single architecture.

The TDA3x SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed and

floating-point TMS320C66x digital signal processors (DSP), Vision AccelerationPac with Embedded Vision

Engines (EVE), and dual ARM Cortex-M4 processors. The device allows low power profile in different

package options (including Package-On-Package) to enable small form factor designs. TDA3x SoC also

integrates a host of peripherals including multi-camera interfaces (both parallel and serial) for LVDS-based

surround view systems, displays, CAN and GigB Ethernet AVB.

The EVE within the TDA3x Vision AccelerationPac offloads the vision analytics functionality from the

processor while also reducing the power footprint. The Vision AccelerationPac is optimized for vision

processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for

specialized vision processing.

Additionally, Texas Instruments provides a complete set of development tools for the ARM, DSP, and EVE

coprocessor, including C compilers, a DSP assembly optimizer to simplify programming and scheduling,

and a debugging interface for visibility into source code execution.

The TDA3x SoC processor is qualified according to AEC-Q100 standard.

Device Information

PART NUMBER

PACKAGE

BODY SIZE

TDA3x (ABF package)

S-PBGA (367)

15.0 mm x 15.0 mm

TDA3x (ABE package)

S-PBGA (244)

12.0 mm x 12.0 mm

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Device Overview

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