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TSB82AA2-EP Datasheet(PDF) 10 Page - Texas Instruments

No. de pieza TSB82AA2-EP
Descripción Electrónicos  1394b OHCI-Lynx Controller
Download  103 Pages
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Fabricante Electrónico  TI1 [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI1 - Texas Instruments

TSB82AA2-EP Datasheet(HTML) 10 Page - Texas Instruments

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1.2 Features
The TSB82AA2-EP device supports the following features:
Controlled Baseline
--
One Assembly/Test Site, One Fabrication Site
Extended Temperature Performance of --40
°Cto85°C
Enhanced Diminishing Manufacturing Sources (DMS) Support
Enhanced Product-Change Notification
Qualification Pedigree
Single 3.3-V supply (1.8-V internal core voltage with regulator)
3.3-V and 5-V PCI signaling environments
Serial bus data rates of 100M bits/s, 200M bits/s, 400M bits/s, and 800M bits/s
Physical write posting of up to three outstanding transactions
Serial ROM or boot ROM interface supports 2-wire serial EEPROM devices
33-MHz/64-bit and 33-MHz/32-bit selectable PCI interface
Multifunction terminal (MFUNC terminal 1):
--
PCI_CLKRUN protocol per the PCI Mobile Design Guide
--
General-purpose I/O
--
CYCLEIN/CYCLEOUT for external cycle timer control for customized synchronization
PCI burst transfers and deep FIFOs to tolerate large host latency:
--
Transmit FIFO—5K asynchronous
--
Transmit FIFO—2K isochronous
--
Receive FIFO—2K asynchronous
--
Receive FIFO—2K isochronous
D0, D1, D2, and D3 power states and PME events per the PCI Bus Power Management Interface
Specification
Programmable asynchronous transmit threshold
Isochronous receive dual-buffer mode
Out-of-order pipelining for asynchronous transmit requests
Register access fail interrupt when the PHY SYSCLK is not active
Initial bandwidth available and initial channels available registers
Digital video and audio performance enhancements
Fabricated in advanced low-power CMOS process
Packaged in 144-terminal LQFP (PGE)
Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range.
This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST,
electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this
component beyond specified performance and environmental limits.


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