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ILC6383 Datasheet(PDF) 9 Page - Fairchild Semiconductor |
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ILC6383 Datasheet(HTML) 9 Page - Fairchild Semiconductor |
9 / 15 page PRODUCT SPECIFICATION ILC6383 REV. 1.2.6 6/13/02 9 External Component Selection Inductors The ILC6383 is designed to work with a 15µH inductor in most applications. There are several vendors who supply standard surface mount inductors to this value. Suggested suppliers are shown in Table 1. Higher values of inductance will improve efficiency, but will reduce peak inductor current and consequently ripple and noise, but will also limit output current. Capacitors Input Capacitor The input capacitor is necessary to minimize the peak current drawn from the battery. Typically a 10µF tantalum capacitor is recommended. Low equivalent series resistance (ESR) capacitors will help to minimize battery voltage ripple. Output Capacitor Low ESR capacitors should be used at the output of the ILC6383 to minimize output ripple. The high switching speeds and fast changes in the output capacitor current, mean that the equivalent series impedance of the capacitor can contribute greatly to the output ripple. In order to minimize these effects choose an output capacitor with less than 10nH of equivalent series inductance (ESL) and less than 100m Ω of equivalent series resistance (ESR). Typically these charac- teristics are met with ceramic capacitors, but may also be met with certain types of tantalum capacitors. Suitable vendors are shown in Table 2. Layout and Grounding Considerations High frequency switching and large peak currents means PCB design for DC-DC converters requires careful consider- ation. As a general rule, place the DC-DC converter circuitry well away from any sensitive RF or analog compo- nents. The layout of the DC-DC converters and its external components are also based on some simple rules to minimize EMI and output voltage ripple. Layout 1. Place all power components, ILC6383, inductor, input capacitor and output capacitor as close together as possible. 2. Keep the output capacitor as close to the ILC6383 as possible with very short traces to the VOUT and GND pins. Typically it should be within 0.25 inches or 6mm. 3. Keep the traces for the power components wide, typically >50mil or 1.25mm. 4. Place the external networks for LBI and VFB close to the ILC6383, but away from the power components as far as possible. Grounding 1. Use a star grounding system with separate traces for the power ground and the low power signals such as LBI/ SD and VFB. The star should radiate from where the power supply enters the PCB. 2. On multilayer boards use component side copper for grounding around the ILC6383 and connect back to a quiet ground plane using vias. Recommended application circuit schematic for ILC6383CIR-ADJ Vendor Part No. Contact Coilcraft D03308P-153 D03316P-153 D01608C-153 (847) 639-6400 muRata LQH4N150K LQH3C150K (814) 237-1431 Sumida CDR74B-150MC CD43-150 CD54-150 (847) 956-0666 TDK NLC453232T-150K (847) 390-4373 Description Vendor Contact T495 series tantalum Kemet (864) 963-6300 595D series tantalum Sprague (603) 224-1961 TAJ, TPS series tantalum AVX (803) 946-0690 X5R, X7R Ceramic TDK (847) 390-4373 AVX (803) 946-0690 muRata www.murata.com 47 µF VIN 15 µH COUT 47 µF R1 R2 ILC6383 LX VIN LBI/SD SEL GND LBO VFB VOUT VOUT 1 2 3 4 8 7 6 5 CIN + R3 ON/OFF Local "Quiet" Ground Power Ground L1 PWM PFM |
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