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UC1842A-SP Datasheet(PDF) 4 Page - Texas Instruments |
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UC1842A-SP Datasheet(HTML) 4 Page - Texas Instruments |
4 / 31 page UC1842A-SP, UC1843A-SP, UC1844A-SP SLUS872D – JANUARY 2009 – REVISED MAY 2015 www.ti.com 8 Specifications 8.1 Absolute Maximum Ratings (1) (2) over operating free-air temperature (unless otherwise noted) MIN MAX UNIT VCC Supply voltage, low-impedance source 30 V VI Input voltage (VFB, ISENSE) –0.3 6.3 V Supply current Self limiting IO Output current ±1 A Error amplifier output sink current 10 mA Output energy (capacitive load) 5 μJ PD Power dissipation (TA = 25°C) 1 W Tlead Lead temperature (soldering, 10 s) 300 °C Tstg Storage temperature –65 150 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to ground. Currents are positive in, negative out of the specified terminal. 8.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. 8.3 Recommended Operating Conditions over operating free-air temperature range (TA = TJ = –55°C to 125°C), unless otherwise noted. MIN MAX UNIT VCC Supply voltage 12 25 V Sink/source output current (continuous or time average) 0 200 mA Reference load current 0 20 mA 8.4 Thermal Information UC184xA-SP THERMAL METRIC(1) JG (CDIP) FK (LCCC) UNIT 8 PINS 20 PINS RθJA Junction-to-ambient thermal resistance 103 — °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 9.6 9.0 °C/W RθJB Junction-to-board thermal resistance 69.2 — °C/W ψJT Junction-to-top characterization parameter 13.9 — °C/W ψJB Junction-to-board characterization parameter 73 — °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 4 Submit Documentation Feedback Copyright © 2009–2015, Texas Instruments Incorporated Product Folder Links: UC1842A-SP UC1843A-SP UC1844A-SP |
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