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LM2725MX Datasheet(PDF) 5 Page - National Semiconductor (TI) |
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LM2725MX Datasheet(HTML) 5 Page - National Semiconductor (TI) |
5 / 9 page Electrical Characteristics LM2726 (Continued) VCC = CBOOT = 5V, SW = GND = 0V, unless otherwise specified. Typicals and limits appearing in plain type apply for T A =T J = +25˚C. Limits appearing in boldface type apply over the entire operating temperature range. Symbol Parameter Condition Min Typ Max Units BOTTOM DRIVER t 1 Pull-down Delay Timing Diagram, from PWM_IN Rising Edge 13 ns LOGIC V uvlo_up Power On Threshold VCC rises from 0V toward 5V 2.8 V V uvlo_dn Under-Voltage-Lock-Out Threshold 2.5 V V uvlo_hys Under-Voltage-Lock-Out Hysteresis 0.3 V V IH_EN EN Pin High Input 2.4 V V IL_EN EN Pin Low Input 0.25 V I leak_EN EN Pin Leakage Current EN = VCC = 5V −2 2 µA VCC = 5V, EN = 0V −2 2 t on_min Minimum Positive Input Pulse Width (Note 4) 55 ns t off_min Minimum Negative Input Pulse Width (Note 5) 55 V IH_PWM PWM_IN High Level Input Voltage When PWM_IN pin goes high from 0V 2.4 V V IL_PWM PWM_IN Low Level Input Voltage When PWM_IN pin goes low from 5V 0.25 Note 1: Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating ratings are conditions under which the device operates correctly. Operating Ratings do not imply guaranteed performance limits. Note 2: Maximum allowable power dissipation is a function of the maximum junction temperature, TJMAX, the junction-to-ambient thermal resistance, θJA, and the ambient temperature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PMAX =(TJMAX-TA)/ θJA. The junction-to- ambient thermal resistance, θJA, for LM2725/LM2726 is 172˚C/W. For a TJMAX of 150˚C and TA of 25˚C, the maximum allowable power dissipation is 0.7W. Note 3: ESD machine model susceptibility is 100V. Note 4: If after a rising edge, a falling edge occurs sooner than the specified value, the IC may intermittently fail to turn on the bottom gate when the top gate isoff. As the falling edge occurs sooner and sooner, the driver may start to ignore the pulse and produce no output. Note 5: If after a falling edge, a rising edge occurs sooner than the specified value, the IC may intermittently fail to turn on the top gate when the bottom gate isoff. As the rising edge occurs sooner and sooner, the driver may start to ignore the pulse and produce no output. www.national.com 5 |
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