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TPL0401B-10-Q1 Datasheet(PDF) 4 Page - Texas Instruments |
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TPL0401B-10-Q1 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 31 page  4 TPL0401A-10-Q1 TPL0401B-10-Q1 SLIS182 – NOVEMBER 2016 www.ti.com Product Folder Links: TPL0401A-10-Q1 TPL0401B-10-Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VDD Supply voltage VDD to GND –0.3 7 V IH, IL, IW Continuous current ±5 mA VI Digital input pins (SDA, SCL) –0.3 VDD + 0.3 V Potentiometer pins (H, W) –0.3 VDD + 0.3 TJ(MAX) Maximum junction temperature 130 °C Tstg Storage temperature –65 150 °C (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2500 V Charged-device model (CDM), per AEC Q100-011 ±1000 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VDD Supply voltage 2.7 5.5 V VW,VH, SDA, SCL Terminal voltage 0 VDD V VIH Voltage input high ( SCL, SDA ) 0.7 × VDD VDD V VIL Voltage input low ( SCL, SDA ) 0 0.3 × VDD V IW Wiper current –2 2 mA TA Ambient operating temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TPL0401x-10-Q1 UNIT DCK (SC70) 6 PINS RθJA Junction-to-ambient thermal resistance 234 °C/W RθJC(top) Junction-to-case (top) thermal resistance 110.5 °C/W RθJB Junction-to-board thermal resistance 79 °C/W ψJT Junction-to-top characterization parameter 7.2 °C/W ψJB Junction-to-board characterization parameter 77 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W 7.5 Electrical Characteristics Typical values are specified at 25°C and VDD = 3.3 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RTOTAL End-to-end resistance 8 10 12 k Ω RH Terminal resistance 100 200 Ω RW Wiper resistance 35 100 Ω |
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