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HCPL-4100 Datasheet(PDF) 3 Page - Agilent(Hewlett-Packard) |
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HCPL-4100 Datasheet(HTML) 3 Page - Agilent(Hewlett-Packard) |
3 / 12 page 3 8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4100) 240 ∆T = 115°C, 0.3°C/SEC 0 ∆T = 100°C, 1.5°C/SEC ∆T = 145°C, 1°C/SEC TIME – MINUTES 220 200 180 160 140 120 100 80 60 40 20 0 260 12 3 456789 10 11 12 Thermal Profile (Option #300) Figure 1. Maximum Solder Reflow Thermal Profile. (Note: Use of non-chlorine activated fluxes is recommended.) 0.635 ± 0.25 (0.025 ± 0.010) 12° NOM. 9.65 ± 0.25 (0.380 ± 0.010) 0.635 ± 0.130 (0.025 ± 0.005) 7.62 ± 0.25 (0.300 ± 0.010) 5 6 7 8 4 3 2 1 9.65 ± 0.25 (0.380 ± 0.010) 6.350 ± 0.25 (0.250 ± 0.010) 1.016 (0.040) 1.194 (0.047) 1.194 (0.047) 1.778 (0.070) 9.398 (0.370) 9.906 (0.390) 4.826 (0.190) TYP. 0.381 (0.015) 0.635 (0.025) PAD LOCATION (FOR REFERENCE ONLY) 1.080 ± 0.320 (0.043 ± 0.013) 4.19 (0.165) MAX. 1.780 (0.070) MAX. 1.19 (0.047) MAX. 2.54 (0.100) BSC DIMENSIONS IN MILLIMETERS (INCHES). LEAD COPLANARITY = 0.10 mm (0.004 INCHES). 0.254 + 0.076 - 0.051 (0.010 + 0.003) - 0.002) |
Número de pieza similar - HCPL-4100 |
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Descripción similar - HCPL-4100 |
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