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MC14106BDG Datasheet(PDF) 1 Page - ON Semiconductor |
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MC14106BDG Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 8 page © Semiconductor Components Industries, LLC, 2014 August, 2014 − Rev. 10 1 Publication Order Number: MC14106B/D MC14106B Hex Schmitt Trigger The MC14106B hex Schmitt Trigger is constructed with MOS P−channel and N−channel enhancement mode devices in a single monolithic structure. These devices find primary use where low power dissipation and/or high noise immunity is desired. The MC14106B may be used in place of the MC14069UB hex inverter for enhanced noise immunity or to “square up” slowly changing waveforms. This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must be left open. Features • Increased Hysteresis Voltage Over the MC14584B • Supply Voltage Range = 3.0 Vdc to 18 Vdc • Capable of Driving Two Low−power TTL Loads or One Low−power Schottky TTL Load Over the Rated Temperature Range • Pin−for−Pin Replacement for CD40106B and MM74C14 • Can Be Used to Replace the MC14584B or MC14069UB • NLV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable • These Devices are Pb−Free and are RoHS Compliant MAXIMUM RATINGS (Voltages Referenced to VSS) Symbol Parameter Value Unit VDD DC Supply Voltage Range − 0.5 to +18.0 V Vin, Vout Input or Output Voltage Range (DC or Transient) − 0.5 to VDD + 0.5 V Iin, Iout Input or Output Current (DC or Transient) per Pin ±10 mA PD Power Dissipation, per Package (Note 1) 500 mW TA Ambient Temperature Range − 55 to +125 °C Tstg Storage Temperature Range − 65 to +150 °C TL Lead Temperature (8−Second Soldering) 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. Temperature Derating: “D/DW” Packages: –7.0 mW/ °C From 65°C To 125°C http://onsemi.com MARKING DIAGRAMS SOIC−14 NB TSSOP−14 1 14 14106BG AWLYWW A = Assembly Location WL, L = Wafer Lot YY, Y = Year WW, W = Work Week G or G = Pb−Free Package See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. ORDERING INFORMATION 14 106B ALYW G G 1 14 (Note: Microdot may be in either location) SOIC−14 NB D SUFFIX CASE 751A TSSOP−14 DT SUFFIX CASE 948G |
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