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ASMT-YTB8-0BA02 Datasheet(PDF) 13 Page - AVAGO TECHNOLOGIES LIMITED |
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ASMT-YTB8-0BA02 Datasheet(HTML) 13 Page - AVAGO TECHNOLOGIES LIMITED |
13 / 15 page Avago Technologies - 13 - ASMT-YTB8-0BA02 Data Sheet Precautionary Notes Precautionary Notes 1. Handling precautions The encapsulation material of the LED is made of silicone for better product reliability. Compared to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Observe pecial handling precautions during assembly of silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. Refer to Application Note AN5288, Silicone Encapsulation for LED: Advantages and Handling Precautions for more information. a. Do not poke sharp objects into the silicone encapsulant. Sharp objects, such as tweezers or syringes, might apply excessive force or even pierce through the silicone and cause failures to the LED die or wire bond. b. Do not touch the silicone encapsulant. Uncontrolled forces acting on the silicone encapsulant might result in excessive stress on the wire bond. Hold the LED only by the body. c. Do not stack assembled PCBs together. Use an appropriate rack to hold the PCBs. d. The surface of the silicone material attracts dust and dirt easier than epoxy due to its surface tackiness. To remove foreign particles on the surface of silicone, use a cotton bud with isopropyl alcohol (IPA). During cleaning, rub the surface gently without putting pressure on the silicone. Ultrasonic cleaning is not recommended. e. For automated pick and place, Avago has tested the following nozzle size to work with this LED. However, due to the possibility of variations in other parameters, such as pick and place machine maker/model and other settings of the machine, customers should verify that the selected nozzle will not cause damage to the LED. 2. Handling of moisture sensitive device This product has a Moisture Sensitive Level 3 rating per JEDEC J-STD-020. Refer to Avago Application Note AN5305, Handling of Moisture Sensitive Surface Mount Devices, for additional details and a review of proper handling procedures. a. Before use: An unopened moisture barrier bag (MBB) can be stored at < 40 °C / 90% RH for 12 months. If the actual shelf life has exceeded 12 months and the humidity indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. Do not open the MBB prior to assembly (e.g., for IQC). b. Control after opening the MBB: Read the humidity indicator card (HIC) immediately upon opening of the MBB. Keep the LEDs at < 30 °C / 60% RH at all times, and all high temperature-related processes, including soldering, curing or rework, must be completed within 168 hours. c. Control for unfinished reel: Store unused LEDs in a sealed MBB with desiccant or desiccator at < 5% RH. d. Control of assembled boards: If the PCB soldered with the LEDs is to be subjected to other high-temperature processes, store the PCB in a sealed MBB with desiccant or desiccator at < 5% RH to ensure that all LEDs have not exceeded their floor life of 168 hours. e. Baking is required if: The HIC indicator is not BROWN at 10% and is AZURE at 5%. The LEDs are exposed to condition of > 30 °C / 60% RH at any time. The LED floor life exceeded 168 hrs. The recommended baking condition is: 60 °C ±5 °C for 20 hrs. Baking should only be done once. f. Storage The soldering terminals of these Avago LEDs are silver plated. If the LEDs are exposed too long in the ambient environment, the silver plating might become oxidized and, thus, affect its solderability performance. As such, keep unused LEDs in a sealed MBB with desiccant or in desiccator at <5 % RH. ID OD ID = 1.7mm OD = 3.5mm |
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