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HLMP-HB71-TVCDD Datasheet(PDF) 7 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-HB71-TVCDD Datasheet(HTML) 7 Page - AVAGO TECHNOLOGIES LIMITED |
7 / 11 page Avago Technologies - 7 - HLMP-HM70/HM71, HLMP-HB70/HB71 Data Sheet Precautions Precautions Lead Forming The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. For better control, it is recommended to use the proper tool to precisely form and cut the leads to the applicable length rather than doing it manually. If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground that prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand soldering operation, as the excess lead length also acts as small heat sink. Soldering and Handling Take care during PCB assembly and soldering process to prevent damage to the LED component. LED component may be effectively hand soldered to PCB. However, it is recommended only under unavoidable circumstances, such as rework. The closest manual soldering distance of the soldering heat source (soldering iron’s tip) to the body is 1.59 mm. Soldering the LED using soldering iron tip closer than 1.59 mm might damage the LED. ESD precautions must be properly applied on the soldering station and personnel to prevent ESD damage to the LED component that is ESD sensitive. Refer to Avago application note AN 1142 for details. The soldering iron used should have a grounded tip to ensure electrostatic charge is properly grounded. Recommended soldering condition: Wave soldering parameters must be set and maintained according to the recommended temperature and dwell time. The customer is advised to perform daily checks on the soldering profile to ensure that it is always conforming to recommended soldering conditions. NOTE PCBs with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if the same wave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB. Avago Technologies LED Configuration Any alignment fixture that is being applied during wave soldering should be loosely fitted and should not apply weight or force on LED. Nonmetal material is recommended as it will absorb less heat during wave soldering process. At elevated temperature, LED is more susceptible to mechanical stress. Therefore, the PCB must allowed to cool down to room temperature prior to handling, which includes removal of alignment fixture or pallet. If the PCB board contains both through hole (TH) LED and other surface mount components, it is recommended that surface mount components be soldered on the top side of the PCB. If the surface mount must be on the bottom side, these components should be soldered using reflow soldering prior to insertion the TH LED. Wave Solderinga,b a. Above conditions refer to measurement with thermocouple mounted at the bottom of PCB. b. It is recommended to use only bottom preheaters in order to reduce thermal stress experienced by LED. Manual Solder Dipping Pre-heat temperature 105 °C Max. — Preheat time 60 sec Max — Peak temperature 260 °C Max. 260 °C Max. Dwell time 5 sec Max. 5 sec Max 1.59mm Cathode InGaN device |
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