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HLMP-HB71-TVCDD Datasheet(PDF) 7 Page - AVAGO TECHNOLOGIES LIMITED

No. de pieza HLMP-HB71-TVCDD
Descripción Electrónicos  Green and Blue 5mm Standard Oval LEDs
Download  11 Pages
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Fabricante Electrónico  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Página de inicio  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

HLMP-HB71-TVCDD Datasheet(HTML) 7 Page - AVAGO TECHNOLOGIES LIMITED

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Avago Technologies
- 7 -
HLMP-HM70/HM71, HLMP-HB70/HB71
Data Sheet
Precautions
Precautions
Lead Forming
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
For better control, it is recommended to use the proper
tool to precisely form and cut the leads to the applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after the
soldering process. The solder connection forms a
mechanical ground that prevents mechanical stress due to
lead cutting from traveling into LED package. This is highly
recommended for hand soldering operation, as the excess
lead length also acts as small heat sink.
Soldering and Handling
Take care during PCB assembly and soldering process to
prevent damage to the LED component.
LED component may be effectively hand soldered to PCB.
However, it is recommended only under unavoidable
circumstances, such as rework. The closest manual
soldering distance of the soldering heat source (soldering
iron’s tip) to the body is 1.59 mm. Soldering the LED using
soldering iron tip closer than 1.59 mm might damage the
LED.
ESD precautions must be properly applied on the
soldering station and personnel to prevent ESD damage to
the LED component that is ESD sensitive. Refer to Avago
application note AN 1142 for details. The soldering iron
used should have a grounded tip to ensure electrostatic
charge is properly grounded.
Recommended soldering condition:
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. The customer is advised to perform daily checks on
the soldering profile to ensure that it is always conforming
to recommended soldering conditions.
NOTE
PCBs with different size and design
(component density) will have different heat
mass (heat capacity). This might cause a
change in temperature experienced by the
board if the same wave soldering setting is
used. So, it is recommended to recalibrate the
soldering profile again before loading a new
type of PCB.
Avago Technologies LED Configuration
Any alignment fixture that is being applied during wave
soldering should be loosely fitted and should not apply
weight or force on LED. Nonmetal material is
recommended as it will absorb less heat during wave
soldering process.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, the PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
If the PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended that
surface mount components be soldered on the top side of
the PCB. If the surface mount must be on the bottom side,
these components should be soldered using reflow
soldering prior to insertion the TH LED.
Wave
Solderinga,b
a.
Above conditions refer to measurement with thermocouple mounted
at the bottom of PCB.
b.
It is recommended to use only bottom preheaters in order to reduce
thermal stress experienced by LED.
Manual Solder
Dipping
Pre-heat temperature
105 °C Max.
Preheat time
60 sec Max
Peak temperature
260 °C Max.
260 °C Max.
Dwell time
5 sec Max.
5 sec Max
1.59mm
Cathode
InGaN device


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