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Si7034-A10-IMR Datasheet(PDF) 5 Page - Silicon Laboratories

No. de pieza Si7034-A10-IMR
Descripción Electrónicos  Mobile smartphones and tablets
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Si7034-A10-IMR Datasheet(HTML) 5 Page - Silicon Laboratories

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Si7034-A10
Rev. 1.0
5
Conversion Time
tCONV
Normal Mode, RH conversion1
5.8
8.5
ms
Normal Mode, Temperature conversion1
3.7
6
ms
Fast Mode, parallel Temp and RH conver-
sion2
0.9
1.5
ms
Fast Mode, additional RH conversion
time4
1.6
2.5
ms
Powerup Time
tPU
From VDD
≥ 1.67 V to ready for a
conversion, 25 °C
10
15
ms
From VDD
≥ 1.67 V to ready for a
conversion, full temperature range
50
ms
After issuing a software reset
command
—1.2
2.0
ms
Table 3. I2C Interface Specifications1
1.67
 V
DD  1.98 V; TA = –40 to +125 °C unless otherwise noted.
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Hysteresis
VHYS
High-to-low versus
low-to-high transition
0.05 x VDD
——
V
SCLK Frequency2
fSCL
400
kHz
SCL High Time
tSKH
0.6
µs
SCL Low Time
tSKL
1.3
µs
Start Hold Time
tSTH
0.6
µs
Notes:
1. All values are referenced to VIL and/or VIH.
2. Depending on the conversion command, the Si7034 may hold the master during the conversion (clock stretch). At
above 300 kHz SCL, the Si7034 may hold the master briefly for user register and device ID transactions. At the highest
I2C speed of 400 kHz the stretching will be <50 µs.
3. Pulses up to and including 50 ns will be suppressed.
Table 2. General Specifications (Continued)
1.67
 V
DD  1.98 V; TA = –40 to +125 °C unless otherwise noted.
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Notes:
1. In Normal Mode, a temperature conversion is performed first, followed by an RH conversion.
2. In Fast Mode, both a temperature conversion and an RH conversion are initiated at the same time and occur in parallel.
3. Current consumption of RH conversion after the temperature conversion has finished. In Fast Mode, the temperature
conversion finishes before the RH conversion.
4. Additional time for RH conversion after the temperature conversion has finished.
5. No conversion or I2C transaction in progress. Typical values measured at 25 °C.
6. Occurs once during powerup. Duration is <5 msec.
7. Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, and Read Firmware Version. Duration
is <100
μs when I2C clock speed is >100 kHz (>200 kHz for 2-byte commands).
8. IDD after a user register write. Initiating any other subsequent I2C transaction on the same bus (such as a user register
read, starting an RH measurement, or traffic directed at other I2C devices) will transition the device to standby mode.
9. Additional current consumption when HTRE bit enabled.


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