2006-02-03

6

BAR95...

Package TSSLP-2-1

For board assembly information please refer to Infineon website "Packages"

Package Outline

Foot Print

Marking Layout

Standard Packing

±0.035

0.32

1

2

+0.01

1) Dimension applies to plated terminal

Cathode

marking

1)

±0.025

0.26

Bottom view

Top view

1

2

Type code

Laser marking

0.43

4

0.35

Cathode

marking

0.27

Copper

Solder mask

Stencil apertures

0.32

Reel ø180 mm = 15.000 Pieces/Reel