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SCW-SC3LF-100R Datasheet(PDF) 2 Page - TT Electronics. |
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SCW-SC3LF-100R Datasheet(HTML) 2 Page - TT Electronics. |
2 / 3 page High Power Chip Resistors SC3 Series High Power Chip Resistors SC3 Series © Welwyn Components Limited Bedlington, Northumberland NE22 7AA, UK Telephone: +44 (0) 1670 822181 · Facsimile: +44 (0) 1670 829465 · Email: info@welwyn-tt.com · Website: www.welwyn-tt.com Issue A · 03.02 Welwyn Components Performance Data Temperature Rise vs Pad Area Construction Resistive thick film material, overglaze and organic protection are screen printed on a 96% alumina substrate. The components are laser trimmed to achieve the required resistance tolerance. Terminations The wrap-around copper terminations have an electroplated nickel barrier and tin-lead solder coating, this ensures excellent ‘leach’ resistance properties and solderability. Chips can withstand immersion in solder at 250˚C for 90 seconds and are suitable for reflow or wave soldering mounting applications. Marking The body protection and marking are resistant to all normal industrial cleaning solvents suitable for printed circuits. Chips are packed and mounted with marking side up. The SC3 Chips are mounted with the actual resistor element mounted face down on its termination pads. 1000 100 10 100mm2 300mm2 1000mm2 Termination Pad Area (each end) 1 watt 2 watt 3 watt Pulse Power Rating 100 10 1 0 . 0 1 0 . 1 1 . 0 Time (sec) The wrap-around terminations have an electroplated nickel barrier and matte tin finish. This ensures excellent ‘leach’ resistance properties and solderability. 04.10 AEC-Q200 Table 7 Method Max.+0.01 Typ. ref Test 3 High Temp. Exposure MIL-STD-202 Method 108 R% 0.5 0.2 4 Temperature Cycling JESD22 Method JA-104 R% 0.25 0.1 6 Moisture Resistance MIL-STD-202 Method 106 R% 0.5 0.2 7 Biased Humidity MIL-STD-202 Method 103 R% 0.5 0.1 8 Operational Life (Cyclic Load) MIL-STD-202 Method 108 R% 1.0 0.5 14 Vibration MIL-STD-202 Method 204 R% 0.25 0.05 15 Resistance to Soldering Heat MIL-STD-202 Method 210 R% 0.25 0.05 16 Thermal Shock MIL-STD-202 Method 107 R% 0.5 0.2 18 Solderability J-STD-002 >95% coverage 21 Board Flex AEC-Q200-005 R% 0.25 0.05 22 Terminal Strength AEC-Q200-006 R% 0.25 0.05 Short Term Overload 6.25 x Pr for 2s R% 0.5 Low Temperature Storage Low Temperature Operation -65°C for 100 hours R% R% R% 0.5 Shelf Life Test Room temp for 12 months -65°C for 1 hour then Pr for 45 minutes 0.5 0.1 Leach Resistance Solder dip at 250°C 90s minimum 04.16 General Note TT Electronics reserves the right to make changes in product specification without notice or liability. All information is subject to TT Electronics’ own data and is considered accurate at time of going to print. © TT Electronics plc www.ttelectronicsresistors.com BI Technologies IRC Welwyn |
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