12.725±0.050

15.2250±0.1250 socket outline

9.00

1.70±0.10 (x4)

non plated mounting holes

0.45 pad (x100)

1.00 typ.

0.850±0.025 (x2)

non plated alignment holes

3.8225

1.2825

1.00 typ.

2.1125*

1.8625

1.250±0.125 (x4)

1.250±0.125 (x2)

16.7250 backing plate outline

4.00 (x4)

backing plate posts

2.00 backing plate central post

centerline of the socket

centerline of the BGA footprint

Target PCB Recommendations

Total thickness: 2.38mm min.

Plating: Gold or Solder finish

PCB Pad height: same or higher than solder mask

*Note: BGA pattern is not symmetrical with

respect to the mounting holes. It is shifted

to the right by 0.375mm.

Ironwood Electronics, Inc.

Tele: (800) 404-0204

www.ironwoodelectronics.com

Tolerances: Hole diameters ±0.03mm [±0.001"], Pitches (from true position) ±0.025mm [±0.001"], substrate thickness tolerance ±10%, all

other tolerances ±0.13mm [±0.005"] unless stated otherwise. Materials and specifications are subject to change without notice.

Description: Recommended PCB Layout

Primary dimension units are millimeters, Secondary dimension units are [inches], Weight is in grams.

STATUS: Released

REV. B

DATE: 2/21/13

Material: ERROR!:Material

Finish: ERROR!:Finish

Weight: ERROR!:Weight

SM-BGA-9031 Drawing

SCALE: 6:1

SHEET: 2 OF 4

ENG: E. Smolentseva

FILE: SM-BGA-9031 Dwg

DRAWN BY: E. Smolentseva