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HLMP-HM65 Datasheet(PDF) 11 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-HM65 Datasheet(HTML) 11 Page - AVAGO TECHNOLOGIES LIMITED |
11 / 14 page Avago Technologies - 11 - HLMP-HG65, HLMP-HM65, HLMP-HB65 Data Sheet Example of Wave Soldering Temperature Profile for TH LED Example of Wave Soldering Temperature Profile for TH LED Ammo Packs Drawing Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 255°C ± 5°C (maximum peak temperature = 260°C) Dwell time: 3.0 sec - 5.0 sec (maximum = 5sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting mechanical force. 60 sec Max TIME (sec) 260°C Max 105°C Max 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 CATHODE 20.50±1.00 0.8071±0.0394 4.00±0.20 0.1575±0.008 0.70±0.20 0.0276±0.0079 12.70±0.30 0.50±0.0118 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 TYP Ø VIEW A - A A A |
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