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IRF820S Datasheet(PDF) 1 Page - Vishay Siliconix |
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IRF820S Datasheet(HTML) 1 Page - Vishay Siliconix |
1 / 8 page IRF820S, SiHF820S, IRF820L, SiHF820L www.vishay.com Vishay Siliconix S15-1659-Rev. D, 20-Jul-15 1 Document Number: 91060 For technical questions, contact: hvm@vishay.com THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Power MOSFET FEATURES • Surface mount • Available in tape and reel • Dynamic dV/dt rating • Repetitive avalanche rated • Fast switching • Ease of paralleling • Simple drive requirements • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 Note * This datasheet provides information about parts that are RoHS-compliant and / or parts that are non-RoHS-compliant. For example, parts with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details. DESCRIPTION Third generation power MOSFETs from Vishay provide the designer with the best combination of fast switching, ruggedized device design, low on-resistance and cost-effectiveness. The D2PAK (TO-263) is a surface mount power package capable of accommodating die size up to HEX-4. It provides the highest power capability and the lowest possible on-resistance in any existing surface mount package. The D2PAK (TO-263) is suitable for high current applications because of its low internal connection resistance and can dissipate up to 2.0 W in a typical surface mount application. Note a. See device orientation. Notes a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11). b. VDD = 50 V, starting TJ = 25 °C, L = 60 mH, Rg = 25 , IAS = 2.5 A (see fig. 12). c. ISD 2.5 A, dI/dt 50 A/μs, VDD VDS, TJ 150 °C. d. 1.6 mm from case. e. When mounted on 1" square PCB (FR-4 or G-10 material). PRODUCT SUMMARY VDS (V) 500 RDS(on) ()VGS = 10 V 3.0 Qg (Max.) (nC) 24 Qgs (nC) 3.3 Qgd (nC) 13 Configuration Single N-Channel MOSFET G D S D2PAK (TO-263) G D S I2PAK (TO-262) G D S Available Available ORDERING INFORMATION Package D2PAK (TO-263) D2PAK (TO-263) D2PAK (TO-263) I2PAK (TO-262) Lead (Pb)-free and halogen-free SiHF820S-GE3 SiHF820STRL-GE3 a SiHF820STRR-GE3 a SiHF820L-GE3 Lead (Pb)-free IRF820SPbF IRF820STRLPbF a IRF820STRRPbF a IRF820LPbF ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted) PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage VDS 500 V Gate-Source Voltage VGS ± 20 Continuous Drain Current VGS at 10 V TC = 25 °C ID 2.5 A TC = 100 °C 1.6 Pulsed Drain Current a IDM 8.0 Linear Derating Factor 0.40 W/°C Linear Derating Factor (PCB mount) e 0.025 Single Pulse Avalanche Energy b EAS 210 mJ Avalanche Current a IAR 2.5 A Repetitive Avalanche Energy a EAR 5.0 mJ Maximum Power Dissipation TC = 25 °C PD 50 W Maximum Power Dissipation (PCB mount) e TA = 25 °C 3.1 Peak Diode Recovery dV/dt c dV/dt 3.5 V/ns Operating Junction and Storage Temperature Range TJ, Tstg -55 to +150 °C Soldering Recommendations (Peak temperature) d for 10 s 300 |
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