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AM29LV033C-90EE Datasheet(PDF) 11 Page - Advanced Micro Devices |
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AM29LV033C-90EE Datasheet(HTML) 11 Page - Advanced Micro Devices |
11 / 48 page 10 Am29LV033C space that each sector occupies. A “sector address” consists of the address bits required to uniquely select a sector. The “Command Definitions” section has de- tails on erasing a sector or the entire chip, or suspend- ing/resuming the erase operation. After the system writes the autoselect command se- quence, the device enters the autoselect mode. The system can then read autoselect codes from the inter- nal register (which is separate from the memory array) on DQ7–DQ0. Standard read cycle timings apply in this mode. Refer to the Autoselect Mode and Autose- lect Command Sequence sections for more informa- tion. I CC2 in the DC Characteristics table represents the ac- tive current specification for the write mode. The “AC Characteristics” section contains timing specification tables and timing diagrams for write operations. Accelerated Program Operation The device offers accelerated program operations through the ACC function. This is one of two functions provided by the ACC pin. This function is primarily in- tended to allow faster manufacturing throughput at the factory. If the system asserts V HH on this pin, the device auto- matically enters the aforementioned Unlock Bypass mode, temporarily unprotects any protected sectors, and uses the higher voltage on the pin to reduce the time required for program operations. The system would use a two-cycle program command sequence as required by the Unlock Bypass mode. Removing V HH from the ACC pin returns the device to normal op- eration. Note that the ACC pin must not be at V HH for operations other than accelerated programming, or device damage may result. Program and Erase Operation Status During an erase or program operation, the system may check the status of the operation by reading the status bits on DQ7–DQ0. Standard read cycle timings and I CC read specifications apply. Refer to “Write Op- eration Status” for more information, and to “AC Char- acteristics” for timing diagrams. Standby Mode When the system is not reading or writing to the de- vice, it can place the device in the standby mode. In this mode, current consumption is greatly reduced, and the outputs are placed in the high impedance state, independent of the OE# input. The device enters the CMOS standby mode when the CE# and RESET# pins are both held at V CC ± 0.3 V. (Note that this is a more restricted voltage range than V IH.) If CE# and RESET# are held at VIH, but not within V CC ± 0.3 V, the device will be in the standby mode, but the standby current will be greater. The device re- quires standard access time (t CE) for read access when the device is in either of these standby modes, before it is ready to read data. The device also enters the standby mode when the RESET# pin is driven low. Refer to the next section, “RESET#: Hardware Reset Pin”. If the device is deselected during erasure or program- ming , the device draws a ctive current until th e operation is completed. I CC3 in the DC Characteristics table represents the standby current specification. Automatic Sleep Mode The automatic sleep mode minimizes Flash device e nergy consumptio n. Th e device au to ma tica lly enables this mode when addresses remain stable for t AC C + 30 ns . T he aut om at ic s l e ep mode is independent of the CE#, WE#, and OE# control signals. Standard address access timings provide new data when addresses are changed. While in sleep mode, output data is latched and always available to the system. I CC 4 in th e DC Characte ristics t abl e rep r e s e n t s t h e aut o m at ic s lee p mo de c u rr e n t specification. RESET#: Hardware Reset Pin The RESET# pin provides a hardware method of re- setting the device to reading array data. When the RE- SET# pin is driven low for at least a period of t RP, the device immediately terminates any operation in progress, tristates all output pins, and ignores all read/write commands for the duration of the RESET# pulse. The device also resets the internal state ma- chine to reading array data. The operation that was in- terrupted should be reinitiated once the device is ready to accept another command sequence, to en- sure data integrity. Current is reduced for the duration of the RESET# pulse. When RESET# is held at V SS±0.3 V, the device draws CMOS standby current (I CC4). If RESET# is held at V IL but not within VSS±0.3 V, the standby current will be greater. The RESET# pin may be tied to the system reset cir- cuitry. A system reset would thus also reset the Flash memory, enabling the system to read the boot-up firm- ware from the Flash memory. If RESET# is asserted during a program or erase op- eration, the RY/BY# pin remains a “0” (busy) until the internal reset operation is complete, which requires a time of t READY (during Embedded Algorithms). The sys- tem can thus monitor RY/BY# to determine whether the reset operation is complete. If RESET# is asserted when a program or erase operation is not executing (RY/BY# pin is “1”), the reset operation is completed |
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