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CDCM61004RHBT Datasheet(PDF) 8 Page - Texas Instruments |
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CDCM61004RHBT Datasheet(HTML) 8 Page - Texas Instruments |
8 / 39 page CDCM61004 SCAS871H – FEBRUARY 2009 – REVISED JANUARY 2016 www.ti.com 7.4 Thermal Information CDCM61004 THERMAL METRIC(1) RHB (VQFN) UNIT 32 PINS RθJA Junction-to-ambient thermal resistance 33.1 °C/W RθJC(top) Junction-to-case (top) thermal resistance 25.7 °C/W RθJB Junction-to-board thermal resistance 0.3 °C/W ψJT Junction-to-top characterization parameter 7.1 °C/W ψJB Junction-to-board characterization parameter 2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 6.12 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. 8 Submit Documentation Feedback Copyright © 2009–2016, Texas Instruments Incorporated Product Folder Links: CDCM61004 |
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