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TPD2S703-Q1 Datasheet(PDF) 5 Page - Texas Instruments |
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TPD2S703-Q1 Datasheet(HTML) 5 Page - Texas Instruments |
5 / 34 page 5 TPD2S703-Q1 www.ti.com SLLSEU8 – MARCH 2017 Product Folder Links: TPD2S703-Q1 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) For recommended values for capacitors and resistors, the typical values assume a component placed on the board near the pin. Minimum and maximum values listed are inclusive of manufacturing tolerances, voltage derating, board capacitance, and temperature variation. The effective value presented should be within the minimum and maximums listed in the table. 6.5 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN TYP MAX UNIT VPWR 5-V DC supply voltage for internal circuitry 4.5 7 V VREF Mode 0. Voltage range for VREF pin (for setting OVP threshold) 3 3.6 V VREF Mode 1. Voltage range for VREF pin (for setting OVP threshold) 0.63 3.8 V VD+, VD– Voltage range from connector-side USB data lines 0 3.6 V D+, D– Voltage range for internal USB data lines 0 3.6 V VEN Voltage range for enable 0 7 V VFLT Voltage range for enable 0 7 V IFLT Current into open drain FLT pin FET 0 3 mA CVPWR VPWR capacitance (1) VPWR pin 1 10 µF CVREF VREF capacitance VREF pin 0.3 1 3 µF CMODE Allowed parasitic capacitance on mode pin from PCB and mode 1 external resistors 20 pF RMODE_0 Resistance to GND to set to mode 0 2 2.6 k Ω RMODE_1 Resistance to GND to set to mode 1 (calculate parallel combination of RTOP and RBOT) 14 20 k Ω (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.6 Thermal Information THERMAL METRIC(1) TPD2S703-Q1 UNIT DGS (VSSOP) DSK (WSON) 10 PINS 10 PINS θJA Junction-to-ambient thermal resistance 167.3 61.5 °C/W θJCtop Junction-to-case (top) thermal resistance 56.9 51.3 °C/W θJB Junction-to-board thermal resistance 87.6 34 °C/W ψJT Junction-to-top characterization parameter 7.7 1.3 °C/W ψJB Junction-to-board characterization parameter 86.2 34.3 °C/W θJCbot Junction-to-case (bottom) thermal resistance N/A 7.7 °C/W |
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