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LF298H Datasheet(PDF) 4 Page - Texas Instruments |
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LF298H Datasheet(HTML) 4 Page - Texas Instruments |
4 / 28 page 4 LF298-MIL SNOSD57 – JUNE 2017 www.ti.com Product Folder Links: LF298-MIL Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications. (3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, RθJA, and the ambient temperature, TA. The maximum allowable power dissipation at any temperature is PD = (TJMAX − TA) / RθJA, or the number given in the Absolute Maximum Ratings, whichever is lower. The maximum junction temperature, TJMAX, for the LF298-MIL is 115°C. (4) Although the differential voltage may not exceed the limits given, the common-mode voltage on the logic pins may be equal to the supply voltages without causing damage to the circuit. For proper logic operation, however, one of the logic pins must always be at least 2 V below the positive supply and 3 V above the negative supply. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT Supply voltage ±18 V Power dissipation (Package limitation, see (3)) 500 mW Operating ambient temperature –25 85 °C Input voltage ±18 V Logic-to-logic reference differential voltage (see (4)) 7 −30 V Output short circuit duration Indefinite Hold capacitor short circuit duration 10 sec Lead temperature H package (soldering, 10 sec.) 260 °C N package (soldering, 10 sec.) 260 °C M package: vapor phase (60 sec.) 215 °C Infrared (15 sec.) 220 °C Storage temperature, Tstg –65 150 °C 6.2 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT Supply voltage ±15 V TJ Ambient temperature –25 85 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. (2) Board mount in 400 LF/min air flow. 6.3 Thermal Information THERMAL METRIC(1) LF298-MIL UNIT D (SOIC) LMC (TO-99) 14 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 80.6 85(2) °C/W RθJC(top) Junction-to-case (top) thermal resistance 38.1 20 °C/W RθJB Junction-to-board thermal resistance 35.4 — °C/W ψJT Junction-to-top characterization parameter 5.8 — °C/W ψJB Junction-to-board characterization parameter 35.1 — °C/W |
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