5

SN74AUP1G240

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SCES627D – MARCH 2005 – REVISED OCTOBER 2017

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

SN74AUP1G240

UNIT

DBV

(SOT-23)

DCK

(SC70)

DRY

(SON)

DSF

(SON)

YFP

(DSBGA)

YZP

(DSBGA)

DPW

(X2SON)

5 PINS

5 PINS

6 PINS

6 PINS

6 PINS

5 PINS

5 PINS

Junction-to-ambient thermal

resistance

230.5

303.6

342.1

377.1

125.4

146.2

504.3

°C/W

Junction-to-case (top) thermal

resistance

172.7

203.8

233.1

187.7

1.9

1.4

234.9

°C/W

Junction-to-board thermal

resistance

62.2

100.9

206.7

236.6

37.2

39.3

370.3

°C/W

Junction-to-top

characterization parameter

49.3

76.1

63.4

29.0

0.5

0.7

44.5

°C/W

Junction-to-board

characterization parameter

61.6

99.3

206.7

236.3

37.5

39.8

369.7

°C/W

Junction-to-case (bottom)

thermal resistance

N/A

N/A

N/A

N/A

N/A

N/A

165.2

°C/W

6.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

0.8 V to 3.6 V

V

1.1 V

1.4 V

1.11

1.03

1.65 V

1.32

1.3

2.3 V

2.05

1.97

1.9

1.85

3 V

2.72

2.67

2.6

2.55