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DAC7654YBT Datasheet(PDF) 2 Page - Burr-Brown (TI) |
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DAC7654YBT Datasheet(HTML) 2 Page - Burr-Brown (TI) |
2 / 28 page DAC7654 SBAS263 − NOVEMBER 2003 www.ti.com 2 ORDERING INFORMATION(1) PRODUCT PACKAGE−LEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE PACKAGE MARKING ORDERING NUMBER TRANSPORT MEDIA, QUANTITY DAC7654Y LQFP−64 PM −40 °C to +85°C DAC7654Y DAC7654YT Tape and Reel, 250 DAC7654Y LQFP−64 PM −40 °C to +85°C DAC7654Y DAC7654YR Tape and Reel, 1500 DAC7654YB LQFP−64 PM −40 °C to +85°C DAC7654YB DAC7654YBT Tape and Reel, 250 DAC7654YB LQFP−64 PM −40 °C to +85°C DAC7654YB DAC7654YBR Tape and Reel, 1500 DAC7654YC LQFP−64 PM −40 °C to +85°C DAC7654YC DAC7654YCT Tape and Reel, 250 DAC7654YC LQFP−64 PM −40 °C to +85°C DAC7654YC DAC7654YCR Tape and Reel, 1500 (1) For the most current specification and package information, see the Package Ordering Addendum at the end of this data sheet. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range unless otherwise noted(1) DAC7654 UNIT IOVDD, VCC and VDD to VSS −0.3 to 11 V IOVDD, VCC and VDD to GND −0.3 to 5.5 V Digital Input Voltage to GND −0.3 to VDD + 0.3 V Digital Output Voltage to GND −0.3 to VDD + 0.3 V ESD-CDM 200 V Maximum Junction Temperature +150 °C Operating Temperature Range −40 to +85 °C Storage Temperature Range −65 to +125 °C Lead Temperature (soldering, 10s) +300 °C (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. |
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