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LM2706TLX Datasheet(PDF) 8 Page - National Semiconductor (TI) |
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LM2706TLX Datasheet(HTML) 8 Page - National Semiconductor (TI) |
8 / 15 page Typical Performance Characteristics (Circuit of Figure 1,V IN = EN = 3.6V, ABD = BYP = 0V, TA = 25˚C, unless otherwise noted.) (Continued) Forced Bypass Operation Vcontrol Response 200409A3 200409A4 Output Voltage Ripple (V OUT = 1.5V) Output Voltage Ripple (V OUT = 3.25V) 200409A5 200409A6 Device Information The LM2706 is a simple, step-down DC-DC converter and bypass switch optimized for powering RF power amplifiers (PAs) in mobile phones, portable communicators, and similar battery powered RF devices. It is designed to allow the RF PA to operate at maximum efficiency over a wide range of power levels from a single LiION battery cell. It is based on a current-mode buck architecture, with synchronous rectifi- cation for high efficiency. It is designed for a maximum load capability of 300 mA. Maximum load range may vary from this depending on input voltage, output voltage and the inductor chosen. The device has all four of the pin-selectable operating modes required for powering RF PAs in mobile phones and other sophisticated portable devices with complex power management needs. Fixed-frequency PWM operation offers regulated output at high efficiency while minimizing interfer- ence with sensitive IF and data acquisition circuits. Forced Bypass mode turns on an internal FET bypass switch to power the PA directly from the battery. Automatic Bypass mode turns on the bypass switch when the input voltage gets close to the set output voltage. This helps the RF power amplifier maintain its operating power during low battery conditions by reducing the dropout voltage across the LM2706. Shutdown mode turns the device off and reduces battery consumption to 0.1 µA (typ). DC PWM mode output voltage precision is ±2%. Efficiency is typically around 95% for a 200 mA load with 3.25V output, 3.9V input. The output voltage is dynamically programmable from 1.5V to 3.25V by adjusting the voltage on the control pin without the need for external feedback resistors. This en- sures longer battery life by being able to change the PA supply voltage dynamically depending on its transmitting power. Additional features include soft-start, current overload pro- tection, over voltage protection and thermal overload protec- tion. The LM2706 is constructed using a chip-scale 10-pin micro SMD package. This package offers the smallest possible size, for space-critical applications such as cell phones, where board area is an important design consideration. Use of a high switching frequency (600 kHz) reduces the size of external components. As shown in Figure 1, only three ex- ternal power components are required for implementation. Use of a micro-SMD package requires special design con- siderations for implementation. (See Micro SMD Package Assembly and Use in the Applications Information section.) Its fine bump-pitch requires careful board design and preci- sion assembly equipment. Use of this package is best suited for opaque-case applications, where its edges are not sub- ject to high-intensity ambient red or infrared light. Also, the system controller should set EN low during power-up and other low supply voltage conditions. (See Shutdown Mode in the Device Information section.) www.national.com 8 |
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