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LMZM23601 Datasheet(Hoja de datos) 5 Page - TI store

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No. de Pieza. LMZM23601
Descripción  36-V, 1-A Step-Down DC-DC Nano Module
Descarga  32 Pages
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Fabricante  TI1 [TI store]
Página de inicio  http://www.ti.com
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LMZM23601
www.ti.com
SNVSAQ4 – DECEMBER 2017
Product Folder Links: LMZM23601
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Copyright © 2017, Texas Instruments Incorporated
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
(1)
MIN
MAX
UNIT
VIN to GND
–0.3
42
V
SW to GND
–0.3
VIN + 0.3
V
BOOT to SW
–0.3
3.6
V
EN to GND
–0.3
42
V
FB to GND (3.3-V and 5-V options)
–0.3
16
V
FB to GND (ADJ option)
–0.3
5.5
V
PGOOD to GND
–0.3
16
V
PGOOD sink current
8
mA
MODE/SYNC to GND
–0.3
42
V
VCC to GND
-0.3
3.6
V
Operating junction temperature, TJ
–40
125
°C
Storage temperature, Tstg
–65
150
°C
(1)
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2)
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings
VALUE
UNIT
V(ESD)
Electrostatic discharge
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001, all pins(1)
±2000
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
±500
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
MAX
UNIT
VIN
Input voltage
4
36
V
VOUT
Output voltage (5 V)
0
5
V
Output voltage (3.3 V)
0
3.3
V
Output voltage (ADJ)
2.5
15
V
IOUT
Output current (1 A)
0
1
A
Output current (0.5 A)
0
0.5
A
TJ
Operating junction temperature
–40
125
°C
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.4 Thermal Information
THERMAL METRIC(1)
LMZM23601
UNIT
SIL (USIP)
10 PINS
RθJA
Junction-to-ambient thermal resistance
45
°C/W
ΨJT
Junction-to-top characterization parameter
3
°C/W
ΨJB
Junction-to-board characterization parameter
20
°C/W




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