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KAT-8-D Datasheet(PDF) 3 Page - Mini-Circuits |
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KAT-8-D Datasheet(HTML) 3 Page - Mini-Circuits |
3 / 4 page Fixed Attenuator Die Page 3 of 4 Notes A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document. B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions. C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp Mini-Circuits® www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com KAT-8-D+ Assembly and Handling Procedure 1. Storage Dice should be stored in a dry nitrogen purged desiccators or equivalent. 2. ESD MMIC GaAs Attenuator dice are susceptible to electrostatic and mechanical damage. Die are supplied in antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static workstation. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter ESD damage to dice. 3. Die Attach The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet height and epoxy coverage around total die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s cure condition. It is recommended to use antistatic die pick up tools only. 4. Wire Bonding Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due to undesirable series inductance. RF-IN RF-Out Ground Ground Assembly Diagram (Ground Bond Wires are optional) Absolute Maximum Ratings Operating Temperature (ground) -40°C to 85°C RF Input Power 1.2W Permanent damage may occur if any of these limits are exceeded. Electrical Specifications at 25°C, 50Ω Parameter Condition (GHz) Min. Typ. Max. Unit Frequency Range DC 43.5 GHz Attenuation1 DC - 5 8.0±0.1 dB 5 - 15 8.0±0.1 15 - 18 8.0±0.1 18 - 26.5 8.0±0.1 26.5 - 43.5 7.9±0.5 VSWR1 DC - 5 1.1 :1 5 - 15 1.1 15 - 18 1.1 18 - 26.5 1.1 26.5 - 43.5 1.2 Operating Input Power at2 : 25°C DC - 43.5 1.2 W 85°C DC - 43.5 0.9 W 1. Electrical specifications are typical measured characteristics on die using MPI Titan Series 250 µm pitch GSG probe. 2. Tested in industry standard 2x2 mm, 6-lead MCLP package. |
Número de pieza similar - KAT-8-D |
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Descripción similar - KAT-8-D |
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