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AD1671 Datasheet(PDF) 2 Page - Analog Devices

No. de Pieza. AD1671
Descripción  12-Bit A/D Converter
Descarga  7 Pages
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Fabricante  AD [Analog Devices]
Página de inicio  http://www.analog.com
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AD1671 Datasheet(HTML) 2 Page - Analog Devices

   
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AD1671
ASD0010777 Rev. M | Page 2 of 7
3.0
Absolute Maximum Ratings. (TA = 25°C, unless otherwise noted)
VCC to ACOM.............................................................................................................-0.5V to +6.5V
VEE to ACOM.............................................................................................................-6.5V to +0.5V
VLOGIC to DCOM.........................................................................................................-0.5V to +6.5V
ACOM to DCOM........................................................................................................-1.0V to +1.0V
VCC to VLOGIC ..............................................................................................................-6.5V to +6.5V
ENCODE to DCOM....................................................................................................-0.5V to VLOGIC +0.5V
REF IN, BPO/UPO to ACOM ....................................................................................-0.5V to VCC +0.5V
AIN to ACOM.............................................................................................................-11V to +11V
Power Dissipation .....................................................................................................1000mW
Operating Temperature Range..................................................................................-55°C to +125°C
Storage Temperature Range.....................................................................................-65°C to +150°C
Lead Temperature (Soldering, 60 sec.) ....................................................................+300°C
Junction Temperature (TJ).........................................................................................+150°C
3.1.
Thermal Characteristics:
Thermal Resistance, SBDIP (D) Package
Junction-to-Case (ΘJC) = 28°C/W Max
Junction-to-Ambient (ΘJA) = 60°C/W Max
Thermal Resistance, Bottom brazed (F) Package
Junction-to-Case (ΘJC) = 22°C/W Max
Junction-to-Ambient (ΘJA) = 60°C/W Max
Figure 2. Functional block diagram


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