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DMP510DL Datasheet(Hoja de datos) 2 Page - Diodes Incorporated

No. de Pieza. DMP510DL
Descripción  P-CHANNEL ENHANCEMENT MODE MOSFET
Descarga  6 Pages
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Fabricante  DIODES [Diodes Incorporated]
Página de inicio  http://www.diodes.com
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DMP510DL
Document number: DS38183 Rev. 1 - 2
2 of 6
www.diodes.com
September 2015
© Diodes Incorporated
DMP510DL
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
-50
V
Gate-Source Voltage
VGSS
±30
V
Continuous Drain Current (Note 6) VGS = -5V
Steady
State
TA = +25°C
TA = +70°C
ID
-180
-130
mA
Maximum Continuous Body Diode Forward Current (Note 6)
IS
-0.5
A
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
IDM
-1.2
A
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
PD
310
mW
Thermal Resistance, Junction to Ambient (Note 5)
Steady State
RθJA
405
°C/W
Total Power Dissipation (Note 6)
PD
500
mW
Thermal Resistance, Junction to Ambient (Note 6)
Steady State
RθJA
251
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BVDSS
-50
V
VGS = 0V, ID = -250µA
Zero Gate Voltage Drain Current
IDSS
-1
µA
VDS = -50V, VGS = 0V
Gate-Source Leakage
IGSS
100
nA
VGS = 20V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(TH)
-0.8
-2.0
V
VDS = VGS, ID = -1mA
Static Drain-Source On-Resistance
RDS (ON)
10
VGS = -5V, ID = -0.1A
Forward Transconductance
gFS
0.25
S
VDS = -25V, ID = -0.1A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
24.6
pF
VDS = -25V, VGS = 0V, f = 1.0MHz
Output Capacitance
Coss
4.8
pF
Reverse Transfer Capacitance
Crss
2.8
pF
Turn-On Delay Time
tD(ON)
2.8
ns
VDD = -30V, ID = -0.27A,
RGEN = 50Ω, VGS = -10V
Turn-On Rise Time
tR

2.6

ns
Turn-Off Delay Time
tD(OFF)
11.1
ns
Turn-Off Fall Time
tF

7.2

ns
Notes:
5. Device mounted on FR-4 PCB, with minimum recommended pad layout.
6.
Device mounted on 1” x 1” FR-4 PCB with high coverage 2oz. Copper, single sided.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.




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