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B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
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to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
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Description (See Figure 2)
RF-Input pad. Connect to Ground Via L1. Add a DC blocking cap in series of appropri-
ate value if required.
RF-Output pad. No external DC blocking cap required.
Control Current pad, voltage level on this pad sets the Idd. Connect to pad 11 via 3.92
Voltage Enable Pad. Voltage level on this pad determines Amplifier is ON or bypassed.
Supply Voltage Pad. Connect to Vdd via L2.
Connect to ground. Use via holes as shown in “Suggested Layout for PCB Design” to
reduce ground path inductance for best performance.
• Wideband: 0.5-5 GHz
• Built-in Bypass switching
• Low Noise figure: 1.5 dB typ. at 2.0 GHz
• High Gain: 18.4 dB typ. at 2 GHz
• Ultra Flat Gain: 0.7 dB from 0.7 to 2.1 GHz
• P1dB: +15.1 dBm typ. at 2.0 GHz
• Minimal matching components
• Specified over full band operation
TSS-53LNB3+ (RoHS compliant) is an advanced ultra-flat gain Low Noise wideband amplifier fabricated
using E-PHEMT technology offering extremely high dynamic range over a broad frequency range. It has
integrated switches enabling users to bypass the amplifier during high signal conditions. In addition, the
TSS-53LNB3+ has good input and output return loss over a broad frequency range without the need for
external matching components. Lead finish is Sn-Ag alloy over Ni and is enclosed in a 12-lead 3x3 mm
MCLP package for good thermal performance.
• Wireless Base Station Systems
• Test and Measurement Systems
• Multi-Band Receivers
CASE STYLE: DQ1225
The +Suffix identifies RoHS Compliance. See our web site
for RoHS Compliance methodologies and qualifications