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TSS-53LNB-D+ Datasheet(PDF) 5 Page - Mini-Circuits

No. de Pieza. TSS-53LNB-D+
Descripción  Low Noise Bypass Amplifier Die
Descarga  6 Pages
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Fabricante  MINI [Mini-Circuits]
Página de inicio  http://www.minicircuits.com
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TSS-53LNB-D+ Datasheet(HTML) 5 Page - Mini-Circuits

   
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Monolithic E-PHEMT MMIC Amplifier Die
Page 5 of 6
Notes
A. Performance and quality attributes and conditions not expressly stated in this specification document are intended to be excluded and do not form a part of this specification document.
B. Electrical specifications and performance data contained in this specification document are based on Mini-Circuit’s applicable established test performance criteria and measurement instructions.
C. The parts covered by this specification document are subject to Mini-Circuits standard limited warranty and terms and conditions (collectively, “Standard Terms”); Purchasers of this part are entitled
to the rights and benefits contained therein. For a full statement of the Standard Terms and the exclusive rights and remedies thereunder, please visit Mini-Circuits’ website at www.minicircuits.com/MCLStore/terms.jsp
Mini-Circuits®
www.minicircuits.com P.O. Box 350166, Brooklyn, NY 11235-0003 (718) 934-4500 sales@minicircuits.com
Assembly Diagram
Assembly and Handling Procedure
1. Storage
Dice should be stored in a dry nitrogen purged desiccators or equivalent.
2. ESD
MMIC EPHEMPT amplifier dice are susceptible to electrostatic and mechanical damage. Die are supplied in
antistatic protected material, which should be opened in clean room conditions at an appropriately grounded anti-static worksta
tion. Devices need careful handling using correctly designed collets, vacuum pickup tips or sharp antistatic tweezers to deter
ESD damage to dice.
3. Die Attach
The die mounting surface must be clean and flat. Using conductive silver filled epoxy, recommended epoxies are DieMat
DM6030HK-PT/H579 or Ablestik 84-1LMISR4. Apply sufficient epoxy to meet required epoxy bond line thickness, epoxy fillet
height and epoxy coverage around total die periphery. Parts shall be cured in a nitrogen filled atmosphere per manufacturer’s
cure condition. It is recommended to use antistatic die pick up tools only.
4. Wire Bonding
Bond pad openings in the surface passivation above the bond pads are provided to allow wire bonding to the dice gold bond
pads. Thermosonic bonding is used with minimized ultrasonic content. Bond force, time, ultrasonic power and temperature are
all critical parameters. Suggested wire is pure gold, 1 mil diameter. Bonds must be made from the bond pads on the die to
the package or substrate. All bond wires should be kept as short as low as reasonable to minimize performance degradation due
to undesirable series inductance.
Recommended Wire Length, Typical
Wire
Wire Length (mm)
Wire Loop Height (mm)
RF-IN
0.9
0.15
DC IN (Vdd), Voltage
Enable, Current Control
0.5
0.15
RF-OUT
0.6
0.15
RF reference plane
Material: Roger 4350B 10 Mil
Dielectric Constant: 3.5
Copper thickness: 0.5 Oz
Finishing: ENIG
Vdd
GRD
DUT
RF Reference Plane
V Enable
RF Reference Plane - No port extension


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