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ML3356RP Datasheet(PDF) 9 Page - LANSDALE Semiconductor Inc. |
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ML3356RP Datasheet(HTML) 9 Page - LANSDALE Semiconductor Inc. |
9 / 9 page www.lansdale.com Page 9 of 9 Issue A LANSDALE Semiconductor, Inc. ML3356 P DIP 20 = RP PLASTIC PACKAGE (ML3356RP) CASE 738–03 SO 20 = -6P PLASTIC PACKAGE (ML3356-6P) CASE 751D–03 (SO–20L) OUTLINE DIMENSIONS 0.050 BSC 0.100 BSC 0.300 BSC 1.27 BSC 2.54 BSC 7.62 BSC MIN MIN MAX MAX MILLIMETERS INCHES DIM 25.66 6.10 3.81 0.39 1.27 0.21 2.80 0° 0.51 27.17 6.60 4.57 0.55 1.77 0.38 3.55 15° 1.01 1.010 0.240 0.150 0.015 0.050 0.008 0.110 0° 0.020 1.070 0.260 0.180 0.022 0.070 0.015 0.140 15° 0.040 A B C D E F G J K L M N NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION “L” TO CENTER OF LEAD WHEN FORMED PARALLEL. 4. DIMENSION “B” DOES NOT INCLUDE MOLD FLASH. 5. 738–02 OBSOLETE, NEW STANDARD 738–03. –A – C K N E GF D 20 PL J 20 PL L M –T– SEATING PLANE 1 10 11 20 0.25 (0.010) T A M M 0.25 (0.010) T B M M B MIN MIN MAX MAX MILLIMETERS INCHES DIM A B C D F G J K M P R 0.510 0.299 0.104 0.019 0.035 0.012 0.009 7° 0.415 0.029 0.499 0.292 0.093 0.014 0.020 0.010 0.004 0° 0.395 0.010 12.95 7.60 2.65 0.49 0.90 0.32 0.25 7° 10.55 0.75 12.65 7.40 2.35 0.35 0.50 0.25 0.10 0° 10.05 0.25 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. 751D–01, AND –02 OBSOLETE, NEW STANDARD 751D–03. 1.27 BSC 0.050 BSC –A – –B – P 10 PL 1 10 11 20 G –T– D 20 PL K C SEATING PLANE R X 45° M F J 0.25 (0.010) B M M 0.25 (0.010) T B A M S S Lansdale Semiconductor reserves the right to make changes without further notice to any products herein to improve reliabili- ty, function or design. Lansdale does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights nor the rights of others. “Typical” parameters which may be provided in Lansdale data sheets and/or specifications can vary in different applications, and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by the customer’s technical experts. Lansdale Semiconductor is a registered trademark of Lansdale Semiconductor, Inc. |
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