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LMZM33603RLRR Datasheet(Hoja de datos) 5 Page - TI store

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No. de Pieza. LMZM33603RLRR
Descripción  4-V to 36-V Input, 3-A Step-Down DC/DC Power Module in QFN Package
Descarga  36 Pages
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Fabricante  TI1 [TI store]
Página de inicio  http://www.ti.com
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LMZM33603
www.ti.com
SNVSAO6C – SEPTEMBER 2017 – REVISED MARCH 2018
Product Folder Links: LMZM33603
Submit Documentation Feedback
Copyright © 2017–2018, Texas Instruments Incorporated
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
The junction-to-ambient thermal resistance, RθJA, applies to devices soldered directly to a 63 mm x 63 mm, 4-layer PCB with 2 oz.
copper and natural convection cooling. Additional airflow reduces RθJA.
(3)
The junction-to-top board characterization parameter, ψJT, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (section 6 and 7). TJ = ψJT × Pdis + TT; where Pdis is the power dissipated in the device and TT is
the temperature of the top of the device.
(4)
The junction-to-board characterization parameter, ψJB, estimates the junction temperature, TJ, of a device in a real system, using a
procedure described in JESD51-2A (sections 6 and 7). TJ = ψJB × Pdis + TB; where Pdis is the power dissipated in the device and TB is
the temperature of the board 1mm from the device.
6.4 Thermal Information
THERMAL METRIC(1)
LMZM33603
UNIT
RLR (QFN)
18 PINS
RθJA
Junction-to-ambient thermal resistance (2)
18.9
°C/W
ψJT
Junction-to-top characterization parameter (3)
2.0
°C/W
ψJB
Junction-to-board characterization parameter (4)
6.2
°C/W
(1)
See Voltage Dropout for information on voltage dropout.
(2)
The maximum output voltage varies depending on the output current (see Output Current vs Output Voltage ).
(3)
The overall output voltage tolerance will be affected by the tolerance of the external RFBT and RFBB resistors.
6.5 Electrical Characteristics
Over –40°C to +105°C ambient temperature, VIN = 24 V, VOUT = 5 V, IOUT = IOUT maximum, fsw = 450 kHz (unless otherwise
noted); CIN1 = 2 × 4.7-µF, 50-V, 1210 ceramic; CIN2 = 100-µF, 50-V, electrolytic; COUT = 4 × 22-µF, 25-V, 1210 ceramic.
Minimum and maximum limits are specified through production test or by design. Typical values represent the most likely
parametric norm and are provided for reference only.
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
INPUT VOLTAGE (VIN)
VIN
Input voltage
Over IOUT range
4(1)
36
V
UVLO
VIN undervoltage lockout
VIN increasing
3.3
3.6
3.9
V
VIN decreasing
3
3.3
3.5
V
ISHDN
Shutdown supply current
VEN = 0 V, VIN = 12 V
2
4
µA
OUTPUT VOLTAGE (VOUT)
VOUT(ADJ)
Output voltage adjust
Over IOUT range
1
13.5(2)
V
IOUT ≤ 2 A
1
18(2)
V
VOUT(Ripple)
Output voltage ripple
20-MHz bandwidth
10
mV
FEEDBACK
VFB
Feedback voltage(3)
TA = 25°C, IOUT = 0 A
0.985
1
1.015
V
Over VIN range, –40°C ≤ TJ ≤ 125°C, IOUT = 0 A
0.98
1
1.02
V
Load regulation
Over IOUT range, TA = 25°C
0.04%
IFB
Feedback leakage current
VFB = 1 V
10
nA
CURRENT
IOUT
Output current
Natural convection, TA = 25°C
0
3
A
Overcurrent threshold
4
A
PERFORMANCE
ƞ
Efficiency
VIN = 24 V,
IOUT = 1.5 A
VOUT = 12 V, fSW = 900 kHz
94%
VOUT = 5 V, fSW = 450 kHz
90%
VOUT = 3.3 V, fSW = 300 kHz
87%
VIN = 12 V,
IOUT = 1.5 A
VOUT = 5 V, fSW = 450 kHz
92%
VOUT = 3.3 V, fSW = 300 kHz
89%
VOUT = 2.5 V, fSW = 250 kHz
87%
Transient response
25% to 75%
load step
1 A/µs slew rate
Over/undershoot
130
mV
Recovery Time
60
µs




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