LMZM23601V5SILR datasheet(35/44 Pages) TI1

No. de pieza	LMZM23601V5SILR

Descripción Electrónicos	36-V, 1-A Step-Down DC/DC Power Module in 3.8-mm x 3-mm Package

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Fabricante Electrónico	TI1 [Texas Instruments]

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INPUT CAPACITOR

PLACED NEXT TO

THE MODULE

MODULE

GND

VIN

MODE

EN

PG

VOUT

FB

OUTPUT

CAPACITOR

VOUT

GND

=THERMAL VIAS

FEEDBACK

CONNECTION

GND COPPER FOR

HEAT SINKING

35

LMZM23601

www.ti.com

SNVSAQ4A – DECEMBER 2017 – REVISED APRIL 2018

Product Folder Links: LMZM23601

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Layout Guidelines (continued)

As an example, consider a typical application of 24-V input 5-V output with 0.8 A of output current and estimate

the required heat-sinking area. For this example consider a maximum ambient temperature TA_MAX of 75°C and

no air flow or additional heat sinking besides the PCB layers. Calculate the maximum allowed package thermal

resistance for this design specification.

From Typical Characteristics, it can be seen that the power dissipation for 24-V input, 5-V output, and 0.8A load

is 0.75 W. Based on Equation 7, for this power dissipation level and 75°C maximum ambient temperature, the

maximum package thermal resistance must be less than 66.7°C/W. To achieve this thermal resistance with a 2-

layer board, the approximate area of the board copper should be at least 9 cm2.

11.2 Layout Examples

Figure 71. Layout Example With Fixed Output Version

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LMZM23601V5SILR Datasheet(PDF) 35 Page - Texas Instruments

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