AD8392

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage

±13 V (+26 V)

Power Dissipation

See Figure 3

Storage Temperature

−65°C to +150°C

Operating Temperature Range

−40°C to +85°C

Lead Temperature Range (Soldering 10 sec)

300°C

Junction Temperature

150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

for device soldered in circuit board for surface-mount packages.

Table 4. Thermal Resistance

Package Type

Unit

LFCSP-32 (CP)

27.27

°C/W

TSSOP-28/EP (RE)

35.33

°C/W

Maximum Power Dissipation

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

more metal directly in contact with the package leads from

metal traces, through holes, ground, and power planes reduces

Figure 3 shows the maximum safe power dissipation in the

package versus the ambient temperature for the LFCSP-32 and

values are approximations.

0

1

2

3

4

5

6

7

–40 –30 –20 –10

0

1020

3040

5060

7080

90

TEMPERATURE (

°C)

LFCSP-32

TSSOP-28/EP

Figure 3. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

See the Thermal Considerations section for additional thermal

design guidance.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the

human body and test equipment and can discharge without detection. Although this product features proprie-

tary ESD protection circuitry, permanent damage may occur on devices subjected to high energy electrostatic

discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of

functionality.