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NCV47721 Datasheet(PDF) 4 Page - ON Semiconductor

No. de Pieza. NCV47721
Descripción  Adjustable LDO with Adjustable Current Limit
Descarga  16 Pages
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Fabricante  ONSEMI [ON Semiconductor]
Página de inicio  http://www.onsemi.com
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NCV47721 Datasheet(HTML) 4 Page - ON Semiconductor

 
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Table 2. MAXIMUM RATINGS
Rating
Symbol
Min
Max
Unit
Input Voltage DC
Vin
−42
45
V
Input Voltage (Note 1)
Load Dump − Suppressed
Us*
60
V
Enable Input Voltage
VEN
−42
45
V
ADJ Input Voltage
VADJ
−0.3
10
V
CSO Voltage
VCSO
−0.3
7
V
DE, EF Voltages
VDE, VEF
−0.3
7
V
Output Voltage
Vout
−1
40
V
Junction Temperature
TJ
−40
150
°C
Storage Temperature
TSTG
−55
150
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Load Dump Test B (with centralized load dump suppression) according to ISO16750−2 standard. Guaranteed by design. Not tested in
production. Passed Class A according to ISO16750−1.
Table 3. ESD CAPABILITY (Note 2)
Rating
Symbol
Min
Max
Unit
ESD Capability, Human Body Model
ESDHBM
−2
2
kV
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
Field Induced Charge Device Model ESD characterization is not performed on plastic molded packages with body sizes < 50 mm2 due
to the inability of a small package body to acquire and retain enough charge to meet the minimum CDM discharge current waveform
characteristic defined in JEDEC JS−002−2014.
Table 4. LEAD SOLDERING TEMPERATURE AND MSL (Note 3)
Rating
Symbol
Min
Max
Unit
Moisture Sensitivity Level
MSL
1
3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS (Note 4)
Rating
Symbol
Value
Unit
Thermal Characteristics (single layer PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
RθJA
RψJL
62.6
23.7
°C/W
Thermal Characteristics (4 layers PCB)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Lead (Note 5)
RθJA
RψJL
44.1
16.8
°C/W
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate. Single layer − according to JEDEC51.3,
4 layers − according to JEDEC51.7
Table 5. RECOMMENDED OPERATING RANGES
Rating
Symbol
Min
Max
Unit
Input Voltage (Note 6)
Vin
4.4
40
V
Nominal Output Voltages
Vout_nom
3.3
20
V
Output Current Limit (Note 7)
ILIM
10
300
mA
Junction Temperature
TJ
−40
150
°C
Current Sense Output (CSO) Capacitor
CCSO
1
4.7
mF
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
6. Minimum Vin = 4.4 V or (Vout + 0.5 V), whichever is higher.
7. Corresponding RCSO is in range from 25.5 kW down to 850 W.


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