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NCV47721 Datasheet(PDF) 14 Page - ON Semiconductor

No. de Pieza. NCV47721
Descripción  Adjustable LDO with Adjustable Current Limit
Descarga  16 Pages
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Fabricante  ONSEMI [ON Semiconductor]
Página de inicio  http://www.onsemi.com
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NCV47721 Datasheet(HTML) 14 Page - ON Semiconductor

 
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NCV47721
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14
Thermal Considerations
As power in the device increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the device has good thermal conductivity through the PCB,
the junction temperature will be relatively low with high
power applications. The maximum dissipation the device
can handle is given by:
P
D(MAX) +
T
J(MAX) * TA
RqJA
(eq. 8)
Since TJ is not recommended to exceed 150
°C, then the
device soldered on 645 mm2, 1 oz copper area, FR4 can
dissipate up to 2 W when the ambient temperature (TA) is
25
°C. See Figure 21 for RqJA versus PCB area. The power
dissipated by the device can be calculated from the
following equations:
P
D [ Vin Iq@Iout ) Iout Vin * Vout
(eq. 9)
or
V
in(MAX) [
P
D(MAX) ) Vout
Iout
Iout ) Iq
(eq. 10)
Figure 21. Thermal Resistance vs. PCB Copper Area
COPPER HEAT SPREADER AREA (mm2)
600
700
500
400
300
200
100
0
20
30
50
70
80
100
110
40
60
90
120
1 oz, Single Layer
2 oz, Single Layer
1 oz, 4 Layer
2 oz, 4 Layer
Hints
Vin and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the device and make
traces as short as possible.
ORDERING INFORMATION
Device
Output Voltage
Marking
Package
Shipping
NCV47721PAAJR2G
Adjustable
Line1: NCV4
Line2: 7721
TSSOP−14 Exposed Pad
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D


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